Ultrasonic sensor

ABSTRACT

An ultrasonic sensor includes a transmitting device, receiving devices arranged in an array, and a circuit device. One receiving device is configured as a reference receiving device. The circuit device includes a reference signal generator and first and second synchronous detectors. The reference signal generator generates a reference signal by using a received signal of the reference receiving device. The first synchronous detector performs synchronous detection of a received signal of one of the receiving devices based on the reference signal to detect a distance to an object. The second synchronous detector performs synchronous detection of received signals of the receiving devices except the reference receiving device based on the reference signal to detect a direction of the object.

CROSS REFERENCE TO RELATED APPLICATION

This application is based on and incorporates herein by referenceJapanese Patent Applications No. 2007-334112 filed on Dec. 26, 2007, No.2008-41215 filed on Feb. 22, 2008, No. 2008-101302 filed on Apr. 9,2008, No. 2008-135579 filed on May 23, 2008, and No. 2008-276998 filedon Oct. 28, 2008.

FIELD OF THE INVENTION

The present invention relates to an ultrasonic sensor constructed withmultiple sensor devices arranged in an array.

BACKGROUND OF THE INVENTION

An ultrasonic sensor has been proposed that includes multiple sensordevices arranged in an array. For example, such an ultrasonic sensordetects a position (i.e., distance and direction) of an object bycalculating a time interval between transmitting an ultrasonic wave andreceiving the ultrasonic wave (i.e., echo) reflected from the object andby calculating a phase difference between the ultrasonic waves receivedby receiving devices.

In an ultrasonic sensor disclosed in JP-A-2007-170975, a synchronousdetection of a received signal is performed on each receiving element todetect a phase difference between ultrasonic waves received by thereceiving devices. In such an approach, the Doppler effect can bereduced. However, since the synchronous detection is performed on eachreceiving element, the ultrasonic sensor needs many processing devices.Accordingly, the ultrasonic sensor is increased in size.

In an ultrasonic sensor, a detection error may be caused by a directwave that is directly received by a receiving device without beingreflected by the object. JP-A-2007-170975 discloses a technique forreducing the detection error caused by the direct wave. According to thetechnique, an electrical signal having an opposite phase to anultrasonic wave transmitted by a transmitting device is supplied to adetection circuit, which detects an object based on the ultrasonic wavereceived by a receiving device. The technique may be effective only whenthe transmitting device and the receiving device are physicallyseparated from each other.

In an ultrasonic sensor disclosed in JP-A-2000-253496, multiple sensordevices are arranged in an array such that a transmitting device and areceiving device are physically joined together through an adhesive. Adetection sensitivity of the ultrasonic sensor can be improved bycausing the transmitting device to vibrate strongly so as to increasepressure of the ultrasonic wave transmitted by the transmitting device.However, when the transmitting device vibrates strongly to transmit theultrasonic wave of high pressure, the vibration of the transmittingdevice is likely to propagate to the receiving device through theadhesive. The vibration propagation from the transmitting device to thereceiving device may cause a detection error. The technique disclosed inJP-A-2007-170975 is not effective for reducing the detection errorcaused by the vibration propagation.

SUMMARY OF THE INVENTION

In view of the above, it is an object of the present invention toprovide an ultrasonic sensor constructed with multiple sensor devicesarranged in an array and configured to reduce at least one of a Dopplereffect, a vibration propagation, and size.

According to a first aspect of the present invention, an ultrasonicsensor for detecting an object includes a transmitting device, multiplereceiving devices, and a circuit device. The transmitting devicetransmits an ultrasonic wave to the object. Each receiving devicereceives the ultrasonic wave reflected from the object and outputs areceived signal corresponding to the received ultrasonic wave. Thereceiving devices include a reference receiving device and at least onenon-reference receiving device. The circuit device is electricallycoupled to the receiving devices and processes the received signals ofthe receiving devices. The circuit device includes a reference signalgenerator, a first synchronous detector, and a second synchronousdetector. The reference signal generator generates a reference signal byusing the received signal of the reference receiving device. The firstsynchronous detector performs synchronous detection of the receivedsignal of one of the reference receiving device and the non-referencereceiving device based on the reference signal to detect a time intervalbetween transmitting and receiving the ultrasonic wave. The firstsynchronous detector calculates a distance to the object based on thedetected time interval. The second synchronous detector performssynchronous detection of the received signal of the non-referencereceiving device based on the reference signal to detect a phasedifference between the received signals of the reference receivingdevice and the non-reference receiving device. The second synchronousdetector calculates a direction of the object based on the phasedifference.

According to a second aspect of the present invention, an ultrasonicsensor for detecting an object includes multiple sensing devicesarranged in an array and a circuit device. Each sensing device includesa piezoelectric element and an acoustic matching member having a firstsurface exposed to space where the object exists and a second surfacejoined to the piezoelectric element. The circuit device is electricallycoupled to the piezoelectric element. One of the sensing devices isconfigured as a transmitting device that transmits an ultrasonic waveupon reception of a transmission signal outputted from the circuitdevice. At least another one of the sensing devices is configured as areceiving device that receives the ultrasonic wave reflected from theobject and outputs a received signal corresponding to the receivedultrasonic wave to the circuit device. The circuit device includes adrive signal generator that outputs a drive signal to the receivingdevice based on the transmission signal. The drive signal causes thepiezoelectric element of the receiving device to vibrate such that avibration propagated from the transmitting device to the receivingdevice is cancelled.

According to a third aspect of the present invention, an ultrasonicsensor for detecting an object includes multiple sensing devicesarranged in an array and a circuit device. Each sensing device include apiezoelectric element and an acoustic matching member having a firstsurface exposed to space where the object exists and a second surfacejoined to the piezoelectric element. The circuit device is electricallycoupled to the piezoelectric element. A first one of the sensing devicesis configured as a transmitting device that transmits an ultrasonic waveupon reception of a transmission signal outputted from the circuitdevice. A second one of the sensing devices is configured as a dummydevice that detects only a vibration signal corresponding to a vibrationpropagating from the transmitting device to the dummy device. At leastanother one of the sensing devices is configured as a receiving devicethat receives the ultrasonic wave reflected from the object and outputsa received signal corresponding to the received ultrasonic wave to thecircuit device. The circuit device subtracts the vibration signal fromthe received signal of the receiving device to cancel a vibrationpropagated from the transmitting device to the receiving device.

According to a fourth aspect of the present invention, an ultrasonicsensor for detecting a first object includes a transmitting device, areceiving device, a housing, a vibration damper, and a vibrationisolator. The transmitting device transmits an ultrasonic wave to thefirst object. The transmitting device includes a first piezoelectricelement for emitting the ultrasonic wave and a first acoustic matchingmember having a transmitting surface. The emitted ultrasonic wavepropagates through the first acoustic matching member and is transmittedthrough the transmitting surface to the first object. The firstpiezoelectric element is configured as a multilayer piezoelectricelement including multiple piezoelectric layers and multiple electrodelayers interleaved with the piezoelectric layers. The receiving deviceis arranged in an array with the transmitting device and receives theultrasonic wave reflected from the first object. The receiving deviceincludes a second piezoelectric element for detecting the reflectedultrasonic wave and a second acoustic matching member having a receivingsurface. The reflected ultrasonic wave is received through the receivingsurface and propagates through the second acoustic matching member tothe second piezoelectric element. The housing has an inner space foraccommodating the transmitting device and the receiving device. Thehousing has a bottom and an opening portion. The housing is mountable toa second object at the opening portion. The vibration damper isinterposed between the opening portion of the housing and each of thefirst and second acoustic matching members to fix the first and secondacoustic matching members to the housing. Further, the vibration damperis interposed between the first and second acoustic matching members toreduce a propagation of the ultrasonic wave between the first and secondacoustic matching members. The vibration isolator partitions the innerspace of the housing and is located between the transmitting device andthe receiving device to reduce the propagation of the ultrasonic wavebetween the transmitting device and the receiving device.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objectives, features and advantages of the presentinvention will become more apparent from the following detaileddescription made with check to the accompanying drawings. In thedrawings:

FIG. 1A is a diagram illustrating a top view of an ultrasonic sensoraccording to a first embodiment of the present invention, and FIG. 1B isa diagram illustrating a cross-sectional view taken along line IB-IB ofFIG. 1A;

FIG. 2 is a block diagram of a circuit device of the ultrasonic sensorof the first embodiment;

FIG. 3A is a diagram illustrating a top view of an ultrasonic sensoraccording to a modification of the first embodiment, and FIG. 3B is adiagram illustrating a majority circuit of a circuit device of theultrasonic sensor of FIG. 3A;

FIG. 4 is a diagram illustrating a top view of an ultrasonic sensoraccording to another modification of the first embodiment;

FIG. 5A is a partial block diagram of a circuit device of an ultrasonicsensor according to another modification of the first embodiment, andFIG. 5B is a partial block diagram of a circuit device of an ultrasonicsensor according to another modification of the first embodiment;

FIG. 6A is a diagram illustrating a top view of an ultrasonic sensoraccording to a second embodiment of the present invention, and FIG. 6Bis a diagram illustrating a cross-sectional view taken along lineVIB-VIB of FIG. 6A;

FIG. 7 is a block diagram of a circuit device of the ultrasonic sensorof the second embodiment;

FIG. 8 is a diagram illustrating a relationship between a noise changerate and a phase difference between a drive signal applied to areceiving device and a vibration noise prorogating from a transmittingdevice to the receiving device of the ultrasonic sensor of the secondembodiment;

FIG. 9A is a diagram illustrating a transmission signal, a vibrationnoise, and a drive signal of the ultrasonic sensor of the secondembodiment, FIG. 9B is a diagram illustrating a relationship between thevibration noise change rate and the number of waves of the drive signalthat is applied to the receiving device before start of a propagation ofthe vibration noise to the receiving device, and FIG. 9C is a diagramillustrating a relationship between the vibration noise change rate andthe number of waves of the drive signal that is applied to the receivingdevice after end of the propagation of the vibration noise to thereceiving device;

FIG. 10A is a diagram illustrating magnitudes of the transmissionsignal, the vibration noise, and the drive signal, and FIG. 10B is adiagram illustrating a relationship between the vibration noise changerate and a ratio of the magnitude of the drive signal to the magnitudeof the vibration noise;

FIG. 11 is a partial block diagram of a circuit device of an ultrasonicsensor according to a modification of the second embodiment;

FIG. 12A is a diagram illustrating a top view of an ultrasonic sensoraccording to a third embodiment of the present invention, and FIG. 12Bis a diagram illustrating a cross-sectional view taken along lineXIIB-XIIB of FIG. 12A;

FIG. 13 is a block diagram of a circuit device of the ultrasonic sensorof the third embodiment;

FIG. 14A is a diagram illustrating a top view of an ultrasonic sensoraccording to a fourth embodiment of the present invention, and FIG. 14Bis a diagram illustrating a cross-sectional view taken along lineXIVB-XIVB of FIG. 14A;

FIG. 15 is a diagram illustrating a cross-sectional view of anultrasonic sensor according to a modification of the fourth embodiment;

FIG. 16 is a diagram illustrating a cross-sectional view of anultrasonic sensor according to another modification of the fourthembodiment;

FIG. 17 is a diagram illustrating a cross-sectional view of anultrasonic sensor according to another modification of the fourthembodiment;

FIG. 18 is a diagram illustrating a cross-sectional view of anultrasonic sensor according to a fifth embodiment of the presentinvention;

FIG. 19 is a diagram illustrating a cross-sectional view of anultrasonic sensor according to a modification of the fifth embodiment;

FIG. 20 is a diagram illustrating a cross-sectional view of anultrasonic sensor according to another modification of the fifthembodiment;

FIG. 21A is a diagram illustrating a top view of an ultrasonic sensoraccording to a sixth embodiment of the present invention, and FIG. 21Bis a diagram illustrating a top view of an ultrasonic sensor accordingto a modification of the sixth embodiment;

FIG. 22 is a diagram illustrating a cross-sectional view of anultrasonic sensor according to a seventh embodiment of the presentinvention;

FIG. 23 is a diagram illustrating a cross-sectional view of anultrasonic sensor according to a modification of the seventh embodiment;

FIG. 24 is a diagram illustrating a cross-sectional view of anultrasonic sensor according to another modification of the seventhembodiment;

FIG. 25 is a diagram illustrating a cross-sectional view of anultrasonic sensor according to an eighth embodiment of the presentinvention;

FIG. 26 is a diagram illustrating a cross-sectional view of anultrasonic sensor according to a ninth embodiment of the presentinvention;

FIG. 27A is a diagram illustrating a top view of an ultrasonic sensoraccording to a tenth embodiment of the present invention, and FIG. 27Bis a diagram illustrating a cross-sectional view taken along lineXXVIIB-XXVIIB of FIG. 27A;

FIG. 28A is a diagram illustrating a top view of an ultrasonic sensoraccording to an eleventh embodiment of the present invention, and FIG.28B is a diagram illustrating a cross-sectional view taken along lineXXVIIIB-XXVIIIB of FIG. 28A;

FIG. 29A is a diagram illustrating a top view of an ultrasonic sensoraccording to a twelfth embodiment of the present invention, and FIG. 29Bis a diagram illustrating a cross-sectional view taken along lineXXIXB-XXIXB of FIG. 29A;

FIG. 30A is a diagram illustrating a top view of an ultrasonic sensoraccording to a thirteenth embodiment of the present invention, and FIG.30B is a diagram illustrating a cross-sectional view taken along lineXXXB-XXXB of FIG. 30A;

FIG. 31 is a diagram illustrating a top view of an ultrasonic sensoraccording to a fourteenth embodiment of the present invention;

FIG. 32 is a diagram illustrating a top view of an ultrasonic sensoraccording to a modification of the fourteenth embodiment of the presentinvention; and

FIG. 33 is a diagram illustrating a top view of an ultrasonic sensoraccording to another modification of the fourteenth embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment

An ultrasonic sensor 10 according to a first embodiment of the presentinvention is described below with reference to FIGS. 1A, 1B, and 2. Forexample, the ultrasonic sensor 10 can be used as an obstacle sensormounted on a vehicle. An upper direction of FIG. 1B indicates an outsideof the vehicle.

As shown in FIGS. 1A and 1B, the ultrasonic sensor 10 includes foursensor devices 13 p-13 s arranged in an array of two rows and twocolumns, a circuit device 18 electrically coupled to the sensor devices13 p-13 s, and a housing 31 for accommodating the sensor devices 13 p-13s and the circuit device 18.

The sensor device 13 r serves as a transmitting device for transmittingan ultrasonic wave. The sensor device 13 q is located diagonally to thetransmitting device 13 r and serves a reference receiving device. Thesensor device 13 p is located adjacent to the reference receiving device13 q in a horizontal direction and serves as a receiving device (i.e.,non-reference receiving device). The sensor device 13 r is locatedadjacent to the reference receiving device 13 q in a vertical directionand serves as a receiving device (i.e., non-reference receiving device).

The ultrasonic sensor 10 is mounted to a bumper 51 of the vehicle andconfigured to measure a three-dimensional position of an obstacle.

The transmitting device 13 r, the reference receiving device 13 q, andthe receiving devices 13 p, 13 r are identical in structure. Here, thestructure of the receiving device 13 p is described. The receivingdevice 13 p includes a piezoelectric element 11 p and an acrosticmatching member 12 p joined to the piezoelectric element 11 p. Thepiezoelectric element 11 p can both emit and detect an ultrasonic wave.The acrostic matching member 12 p receives the ultrasonic wave reflectedfrom the obstacle and allows the received ultrasonic wave to propagateto the piezoelectric element 11 p.

The piezoelectric element 11 p can be, for example, piezoelectriczirconate titanate (PZT). The piezoelectric element 11 p includes apiezoelectric body and a pair of electrodes 14 p, 15 p. Thepiezoelectric body has a rectangular cylindrical shape and is identicalin cross-section to the acoustic matching member 12 p. The electrodes 14p, 15 p are respectively formed on opposite surfaces of thepiezoelectric body in an ultrasonic propagation direction. That is, thepiezoelectric body is sandwiched between the electrodes 14 p, 15 p.Specifically, the electrode 14 p is formed on the surface facing theacrostic matching member 12 p. For example, the electrodes 14 p, 15 pcan be formed by plating or sputtering of platinum (Pt), copper (Cu), orsilver (Ag) or by baking of conductive paste.

A wiring portion 11 a is formed on a side surface of the piezoelectricelement 11 p. The wiring portion 11 a is electrically coupled to theelectrode 14 p. Further, the wiring portion 11 a is electrically coupledto the circuit device 18 through a wire 19. Thus, the electrode 14 p ofthe piezoelectric element 11 p is electrically coupled to the circuitdevice 18 through the wiring portion 11 a and the wire 19. The electrode15 p of the piezoelectric element 11 p is electrically coupled to thecircuit device 18 through another wire 19.

The acoustic matching member 12 p is made of a material having anacoustic impedance that is greater than an acoustic impedance of air andless than an acoustic impedance of the piezoelectric element 11 p. Forexample, the acoustic matching member 12 p can be made of a highdurability resin material such as a polycarbonate resin.

The acoustic matching members 12 p-12 s are arranged such that adistance d between centers of adjacent acoustic matching members issubstantially equal to one-half the wavelength of the ultrasonic wave. Avibration damper 41 is interposed between an inner wall of the housing31 and a side surface of each of the acoustic matching members 12 p-12 sat a position near an exposed surface 12 a of each of the acousticmatching members 12 p-12 s. Further, the vibration damper 41 isinterposed between adjacent acoustic matching members 12 p-12 s. In thisway, the acoustic matching members 12 p-12 s are fixed by the vibrationdamper 41 to the housing 31 near an opening of the housing 31. Thevibration damper 41 damps (i.e., reduces or eliminates) an unwantedvibration propagating from the bumper 51 to the acoustic matchingmembers 12 p-12 s.

A width w of the cross-section of the acoustic matching member 12 p issubstantially equal to or less than one-half the wavelength of theultrasonic wave in air. A thickness t of the acoustic matching member 12p is substantially equal to one-quarter the wavelength of the ultrasonicwave in the acoustic matching member 12 p. In such an approach, astanding wave is produced in the acoustic matching member 12 p. Thus,interference and cancellation between an ultrasonic wave entering theacoustic matching member 12 p and an ultrasonic wave reflected at aninterface between the piezoelectric element 11 p and the acousticmatching member 12 p can be reduced. As a result, the ultrasonic waveentering the acoustic matching member 12 p can efficiently propagate tothe piezoelectric element 11 p.

The circuit device 18 is electrically coupled to an electronic controlunit (ECU) of the vehicle. The ECU is not shown in the drawings. Whenthe ultrasonic sensor 10 transmits the ultrasonic wave, the circuitdevice 18 receives from the ECU a control signal that controls pressureand phase of the ultrasonic wave to be transmitted. The circuit device18 outputs to the piezoelectric element 11 r of the transmitting device13 r a voltage signal according to the control signal. When theultrasonic sensor 10 receives the ultrasonic wave reflected from theobstacle, the circuit device 18 receives from, for example, thepiezoelectric element 11 p of the receiving device 13 p a voltage signalcorresponding to pressure and phase of the received ultrasonic wave. Thecircuit device 18 generates a vibration signal according to the voltagesignal and outputs the vibration signal to the ECU.

A block diagram of the circuit device 18 is illustrated in FIG. 2. Thecircuit device 18 includes amplifiers 21 q, 21 p, 21 s, a phase-lockedloop (PLL) 22, a distance-information synchronous detector 23,phase-information synchronous detectors 24, 25, and an ultrasonictransmitter 26 a. The amplifiers 21 q, 21 p, 21 s amplify receivedsignals of the reference receiving device 13 q, the receiving device 13p, and the receiving device 13 s, respectively.

The phase-locked loop 22 includes a band-pass filter (BPF) 22 a, a phasedetector (PD) 22 b, a low-pass filter (LPF) 22 c, a voltage-controlledoscillator (VCO) 22 d. The voltage-controlled oscillator 22 d controls afrequency of its output voltage according to its input voltage.

The distance-information synchronous detector 23 performs a synchronousdetection of the received signal of the reference receiving device 13 q.The distance-information synchronous detector 23 includes a phasesensitive detector (PSD) 23 a, a low-pass filter (LPF) 23 b, and adistance calculation circuit 23 c. The phase sensitive detector 23 a hasa switch. The distance calculation circuit 23 c includes an amplifier 23d, a comparator 23 e, a time counter (TC) 23 f, and a distancecalculator (DC) 23 g. The comparator 23 e compares an output signal ofthe amplifier 23 d with a reference voltage Vref as a threshold. Thedistance calculator 23 g calculates a distance of the obstacle based onclock information outputted from the time counter 23 f. The clockinformation represents the number of clock signals CLK counted by thetime counter 23 f.

The phase-information synchronous detector 24 performs a synchronousdetection of the received signal of the receiving device 13 p. Thephase-information synchronous detector 24 includes a band-pass filter(BPF) 27 p, a first phase sensitive detector (PSD) 24 a, a second phasesensitive detector (PSD) 24 b, a first low-pass filter (LPF) 24 c, asecond low-pass filter (LPF) 24 d, and an angle calculator 24 e. Thefirst low-pass filter 24 c processes an output signal of the first phasesensitive detector 24 a. The second low-pass filter 24 d processes anoutput signal of the second phase sensitive detector 24 b. The firstphase sensitive detector 24 a receives a frequency-locked signal fromthe phase-locked loop 22 and uses the frequency-locked signal as areference signal to perform the synchronous detection. The second phasesensitive detector 24 b performs the synchronous detection using areference signal that is phase-shifted by π/2 from the frequency-lockedsignal.

The phase-information synchronous detector 25 performs a synchronousdetection of the received signal of the receiving device 13 s. Thephase-information synchronous detector 25 includes a band-pass filter(BPF) 27 s, a first phase sensitive detector (PSD) 25 a, a second phasesensitive detector (PSD) 25 b, a first low-pass filter (LPF) 25 c, asecond low-pass filter (LPF) 25 d, and an angle calculator 25 e. Thefirst low-pass filter 25 c processes an output signal of the first phasesensitive detector 25 a. The second low-pass filter 25 d processes anoutput signal of the second phase sensitive detector 25 b. The firstphase sensitive detector 25 a receives the frequency-locked signal fromthe phase-locked loop 22 and uses the frequency-locked signal as areference signal to perform the synchronous detection. The second phasesensitive detector 25 b performs the synchronous detection using areference signal that is phase-shifted by π/2 from the frequency-lockedsignal.

The ultrasonic transmitter 26 a outputs a transmission signal St to thetransmitting device 13 r. Upon receipt of the transmission signal Stfrom the ultrasonic transmitter 26 a, the transmitting device 13 rtransmits an ultrasonic wave. At the same time, the ultrasonictransmitter 26 a outputs the transmission signal St to the time counter23 f.

The ultrasonic sensor 10 detects the obstacle as follows. The detectionof the position of the obstacle requires both distance information Ddand phase difference information Dp. The distance information Ddcorresponds to a distance between the ultrasonic sensor 10 and theobstacle, and the phase difference information Dp corresponds to adirection (i.e., angle) of the obstacle with respect to the ultrasonicsensor 10. The phase difference information Dp consists of horizontalphase difference information Dph and vertical phase differenceinformation Dpv.

Firstly, the circuit device 18 receives from the ECU the control signalthat controls pressure and phase of an ultrasonic wave to betransmitted. In the circuit device 18, the ultrasonic transmitter 26 aoutputs the transmission signal St to the piezoelectric element 11 r ofthe transmitting device 13 r according to the control signal. Thepiezoelectric element 11 r vibrates according to the transmission signalSt and thus emits the ultrasonic wave having the controlled pressure andphase. The emitted ultrasonic wave propagates through the acousticmatching member 12 r and is transmitted to outside of the vehiclethrough the transmitting surface 12 a of the acoustic matching member 12r.

The ultrasonic wave transmitted through the transmitting surface 12 a ofthe acoustic matching member 12 r is reflected from the obstacle. Thereflected ultrasonic wave is received through the receiving surfaces 12a of the acoustic matching members 12 q, 12 p, and 12 s, respectively.The received ultrasonic waves propagate to the piezoelectric elements 11q, 11 p, and 11 s through the acoustic matching members 12 q, 12 p, and12 s, respectively. Then, the ultrasonic waves are converted to thereceived signals (i.e., voltage signals) by the piezoelectric elements11 q, 11 p, and 11 s, respectively.

The received signals of the receiving devices 13 q, 13 p, and 13 s havedifferent phases. Here, it is assumed that the received signal of thereference receiving device 13 q is given by sin(ωt+α), that the receivedsignal of the receiving device 13 p is given by sin(ωt+β), and that thereceived signal of the receiving device 13 r is given by sin(ωt+γ). Asnoted previously, the receiving device 13 p is located adjacent to thereference receiving device 13 q in the horizontal direction, thereceiving device 13 r is located adjacent to the reference receivingdevice 13 q in the vertical direction.

The received signal of the reference receiving device 13 q is amplifiedby the amplifier 21 p and then inputted to the phase-locked loop 22. Inthe phase-locked loop 22, the band-pass filter 22 a removes unwantedfrequency components from the received signal of the reference receivingdevice 13 q. An output signal of the band-pass filter 22 a is low-passfiltered by the low-pass filter 22 c and then inputted to thevoltage-controlled oscillator 22 d. The phase detector 22 b detects aphase difference between the received signal of the reference receivingdevice 13 q and an output signal of the voltage-controlled oscillator 22d. The phase difference is feedback to the voltage-controlled oscillator22 d. Thus, the output signal of the voltage-controlled oscillator 22 dis synchronized with (i.e., locked to the frequency of) the receivedsignal of the reference receiving device 13 q.

Below, a method of obtaining the distance information Dd is described.In the distance-information synchronous detector 23, the received signalof the reference receiving device 13 q is inputted to the phasesensitive detector 23 a. The phase sensitive detector 23 a is switchedbetween an amplify (x1) and an inverter (x−1) synchronously with thefrequency-locked signal received from the phase-locked loop 22. In thisway, the phase sensitive detector 23 a performs the synchronousdetection by using the frequency-locked signal as a reference signal. Asa result of the synchronous detection, a frequency component of thereceived signal equal to a frequency of the reference signal isconverted to a DC component and passes through the low-pass filter 23 b.The other components of the received signal are converted to ACcomponents and thus removed by the low-pass filter 23 b.

In the distance calculation circuit 23 c, an output signal of thelow-pass filter 23 b is amplified by the amplifier 23 d and theninputted to the comparator 23 e. The comparator 23 e compares theinputted signal with the reference voltage Vref. If a voltage level ofthe inputted signal exceeds the reference voltage Vref, the comparator23 e outputs a receipt signal to the time counter 23 f. The time counter23 f counts clock signals CLK from when the transmission signal St isreceived to when the receipt signal is received. Thus, the time counter23 f can accurately measure a time elapsed from when the ultrasonic waveis transmitted by the transmitting device 13 r to when the ultrasonicwave is received by the reference receiving device 13 q. The timecounter 23 f outputs to the distance calculator 23 g the clockinformation representing the number of clock signals CLK counted by thetime counter 23 f. The distance calculator 23 g calculates the distancebetween the ultrasonic sensor 10 and the obstacle based on the clockinformation and outputs the distance information Dd corresponding to thecalculated distance.

Below, a method of obtaining the horizontal phase difference informationDph is described below. The received signal of the receiving device 13p, which is located adjacent to the reference receiving device 13 q inthe horizontal direction, is amplified by the amplifier 23 d and theninputted to the phase-information synchronous detector 24 via theband-pass filter 27 p. If a signal to noise (S/N) ratio of the receivedsignal of the receiving device 13 p is good, the band-pass filter 27 pcan be eliminated.

In the phase-information synchronous detector 24, the received signal ofthe reference receiving device 13 p is inputted to the first phasesensitive detector 24 a. The first phase sensitive detector 24 a isswitched between an amplify (x1) and an inverter (x−1) synchronouslywith the frequency-locked signal received from the phased-lock loop 22.In this way, the first phase sensitive detector 24 a performs thesynchronous detection by using the frequency-locked signal as areference signal.

Further, in the phase-information synchronous detector 24, the receivedsignal of the reference receiving device 13 p is inputted to the secondphase sensitive detector 24 b. The second phase sensitive detector 24 bis switched between an amplify (x1) and an inverter (x−1) synchronouslywith a π/2-phase-shifted signal that is phase-shifted by π/2 from thefrequency-locked signal. In this way, the second phase sensitivedetector 24 b performs the synchronous detection by using theπ/2-phase-shifted signal as a reference signal.

The synchronous detection performed by the first phase sensitivedetector 24 a is described in detail below. In the first phase sensitivedetector 24 a, the received signal is given by sin(ωt+β), and thereference signal is given by sin(ωt+α). The following equation isobtained by multiplying the received signal of sin(ωt+β) by thereference signal of sin(ωt+α).

sin(ωt+β)sin(ωt+α)=−½ cos(2ωt+α+β)+½ cos(β−α)   (1)

In the above equation (1), a frequency component of the received signalequal to a frequency of the reference signal is converted to a DCcomponent and passes through the low-pass filter 24 c. The othercomponents of the received signal are converted to AC components andremoved by the low-pass filter 24 c. That is, the first low-pass filter24 c removes the first term “−½ cos(2ωt+α+β)” of the equation (1) andpasses the second term “½ cos(β−α)”.

Next, the synchronous detection performed by the second phase sensitivedetector 24 b is described in detail below. The second phase sensitivedetector 24 b performs the synchronous detection using theπ/2-phase-shifted signal as a reference signal.

In the second phase sensitive detector 24 b, the received signal isgiven by sin(ωt+β), and the reference signal is given by cos(ωt+α). Thefollowing equation is obtained by multiplying the received signal ofsin(ωt+β) by the reference signal of cos(ωt+α).

sin(ωt+β)cos(ωt+α)=½ sin(2ωt+α+β)+½ sin(β−α)   (2)

Therefore, the low-pass filter 24 d removes the first term “½sin(2ωt+α+β)” of the equation (2) and passes the second term “½sin(β−α)”.

Each of the output signals of the low-pass filters 24 c, 24 d depend ona phase difference “β−α” between the received signal of the referencereceiving device 13 q and the received signal of the receiving device 13p. The output signals of the low-pass filters 24 c, 24 d are inputted tothe angle calculator 24 e. The angle calculator 24 e calculates tan(β−α)by using the output signals of the low-pass filters 24 c, 24 d. In suchan approach, the phase difference “β−α” between the received signals ofthe reference receiving device 13 q and the receiving device 13 p can becalculated without influence of amplitudes of the received signals onthe phase difference “β−α”. The tan(β−α) is outputted as the horizontalphase difference information Dph.

Below, a method of obtaining the vertical phase difference informationis described below. The received signal of the receiving device 13 s,which is located adjacent to the reference receiving device 13 q in thevertical direction, is processed by the phase-information synchronousdetector 25 in the same way as the received signal of the receivingdevice 13 p is processed by the phase-information synchronous detector24. Thus, a phase difference “γ−α” between the received signals of thereference receiving device 13 q and the receiving device 13 s iscalculated so that the angle calculator 25 e can output tan(γ−α) as thevertical phase difference information Dpv.

As described above, the received signal of the reference receivingdevice 13 q is used as a reference signal to perform the synchronousdetections of the received signals of the receiving devices 13 p, 13 s.The distance information Dd, the horizontal phase difference informationDph, and the vertical phase difference information Dpv are obtained bythe distance-information synchronous detector 23 and thephase-information synchronous detectors 24, 25. The position of theobstacle is measured based on the obtained information Dd, Dph, and Dpvand distances between the receiving devices 13 q, 13 p, and 13 s. Sinceeach of the receiving devices 13 p, 13 s is located in a directionperpendicular to the reference receiving device 13 q, the ultrasonicsensor 10 can accurately detect the horizontal and vertical phasedifferences corresponding to the position of the obstacle over a widerange of area.

The use of the reference receiving device 13 q reduces influence ofDoppler effect on the phase differences. Therefore, the phasedifferences can be easily, accurately detected.

Since one of the receiving devices is used as a reference to perform thesynchronous detection, a special (specific) reference device for thesynchronous detection is not required. Therefore, the circuit device 18can be simplified in structure and reduced in size.

As described above, according to the first embodiment, the ultrasonicsensor 10 can have the following advantages.

(1) The phase-looked loop 22 generates a reference signal that is lockedto the frequency of the the received signal of the reference receivingdevice 13 q. The received signals of the receiving devices 13 p, 13 sare synchronously detected by using the reference signal. The distanceinformation Dd, the horizontal phase difference information Dph, and thevertical phase difference information Dpv are obtained by thedistance-information synchronous detector 23 and the phase-informationsynchronous detectors 24, 25. The position of the obstacle is measuredbased on the obtained information Dd, Dph, and Dpv and distances betweenthe receiving devices 13 q, 13 p, and 13 s. Since each of the receivingdevices 13 p, 13 s is located in the direction perpendicular to thereference receiving device 13 q, the ultrasonic sensor 10 can accuratelydetect the horizontal and vertical phase differences corresponding tothe position of the obstacle over a wide range of area.

Since the influence of Doppler effect on the phase differences isreduced by using the reference receiving device 13 q, the phasedifferences can be easily, accurately detected.

Since one of the receiving devices is used as a reference to perform thesynchronous detection, the circuit device 18 can be simplified instructure and reduced in size.

(2) The reference signal for the synchronous detection is generated bythe phase-locked loop 22. In such an approach, even when the receivedsignal of the reference receiving device 13 q is weak, the referencesignal can be generated accurately.

(3) The time elapsed from when the ultrasonic wave is transmitted by thetransmitting device 13 r to when the ultrasonic wave is received by thereference receiving device 13 q is measured based on the transmissionsignal St outputted from the ultrasonic transmitter 26 a. The distanceto the obstacle is calculated based on the elapsed time. In such anapproach, the distance can be accurately measured.

Modification of First Embodiment

The first embodiment described above can be modified, for example, asfollows.

In the first embodiment, the reference signal for the synchronousdetection is generated by using the phase-locked loop 22. Alternatively,the reference signal can be generated by using another device such as acomparator constructed with an operational amplifier.

In the first embodiment, the distance to the obstacle is calculated bythe distance calculation circuit 23 c based on the transmission signalSt outputted from the ultrasonic transmitter 26 a. Alternatively, thedistance can be calculated based on the received signals of thereceiving devices 13 p, 13 s without using the transmission signal St.

In the first embodiment, the transmitting device 13 r is arrangedtogether with the receiving devices 13 q, 13 p, and 13 s in an array.Alternatively, the transmitting device 13 r can be arranged separatelyfrom the receiving devices 13 q, 13 p, and 13 s. For example, thetransmitting device 13 r can be formed as a separate piece from thereceiving devices 13 q, 13 p, and 13 s and placed outside the housing31.

In the first embodiment, the transmitting device 13 r is locateddiagonally to the reference receiving device 13 q, and the receivingdevices 13 p, 13 s are located in the direction perpendicular to thereference receiving device 13 q. This arrangement can vary depending onan intended use of the ultrasonic sensor 10. For example, the referencereceiving device 13 q and the receiving device 13 s can interchange suchthat the reference receiving device 13 q is located adjacent to thetransmitting device 13 r in the horizontal direction.

The ultrasonic sensor 10 can include multiple transmitting devices. Forexample, in addition to the transmitting device 13 r, the receivingdevice 13 p can be used as a transmitting device. In this case, pressureof an ultrasonic wave transmitted by the ultrasonic sensor 10 can beincreased by simultaneously driving the transmitting devices 13 r, 13 p.Further, ultrasonic transmission interval can be reduced by alternatingdriving the transmitting devices 13 r, 13 p. Furthermore, even when oneof the transmitting devices 13 r, 13 p is broken, the ultrasonic wavecan be transmitted by using the other of the transmitting devices 13 r,13 p. Thus, the ultrasonic sensor 10 can be configured in a redundantmanner.

The number and arrangement of the receiving devices can vary dependingon the intended use. In an example shown in FIG. 3A, a referencereceiving device 61, receiving devices 62-64, and a transmitting device65 line up in the horizontal direction. In such an approach, thehorizontal phase difference information Dph can be accurately obtained.In this case, as shown in FIG. 3B, phase difference information 62 a-64a respectively obtained from the receiving devices 62-64 can be inputtedto a majority circuit. In such an approach, even when there is avariation in the phase difference information 62 a-64 a, the variationcan be reduced. Further, if the variation is caused due to a malfunctionof any of the receiving devices 62-64, the malfunctioning receivingdevice can be identified.

In another example shown in FIG. 4, multiple receiving devices 72 and atransmitting device 73 are arranged circularly around a referencereceiving device 71. In this case, one receiving device 72 located in adirection to the obstacle detects a phase difference smaller than thosedetected by any other receiving devices 72. Therefore, the direction ofthe obstacle can be accurately detected.

The distance-information synchronous detector 23 can obtain the distanceinformation Dd based on the receive signal of a receiving device otherthan the reference receiving device 13 q. For example, the output signalof the low-pass filter 24 c of the phase-information synchronousdetector 24 can be inputted to the distance calculation circuit 23 c sothat the distance-information synchronous detector 23 can obtain thedistance information Dd based on the receive signal of the receivingdevice 13 p.

The reference signal for the synchronous detection can be correctedbased on sensor signals outputted from sensors mounted on the vehicle.For example, as shown in FIG. 5A, the circuit device 18 can include aspeed correction circuit 82. The speed correction circuit 82 adjusts thefrequency of the transmission signal St based on a vehicle speeddetected by a vehicle speed sensor 81, which is mounted on the vehicle.In such an approach, influence of Doppler effect due to the vehiclespeed on the reference signal can be eliminated so that the referencesignal can be generated accurately. In another example shown in FIG. 5B,the circuit device 18 includes a temperature correction circuit 84. Thetemperature correction circuit 84 adjusts the frequency of thetransmission signal St based on a temperature outside the vehicledetected by a temperature sensor 83, which is mounted on the vehicle. Insuch an approach, influence of a sound speed change, due to atemperature change, on the reference signal can be eliminated so thatthe reference signal can be generated accurately.

Second Embodiment

An ultrasonic sensor 20 according to a second embodiment of the presentinvention is described below with reference to FIGS. 6A, 6B, and 7.Differences between the first and second embodiments are as follows.

As shown in FIG. 6A, 6B, the ultrasonic sensor 20 includes four sensordevices 13 p-13 s arranged in an array of two rows and two columns, acircuit device 28 electrically coupled to the sensor devices 13 p-13 s,and the housing 31 for accommodating the sensor devices 13 p-13 s andthe circuit device 28.

The sensor device 13 r serves as a transmitting device for transmittingan ultrasonic wave. Each of the other sensor devices 13 p, 13 q, 13 sserves as a receiving device for receiving the ultrasonic wave reflectedfrom the obstacle. It is noted that although the sensor device 13 q ofthe first embodiment serves as a reference receiving device, the sensordevice 13 q of the second embodiment serves as merely a receivingdevice.

The circuit device 28 is electrically coupled to the ECU (not shown) ofthe vehicle. When the ultrasonic sensor 20 transmits the ultrasonicwave, the circuit device 28 receives from the ECU the control signalthat controls pressure and phase of the ultrasonic wave to betransmitted. The circuit device 28 outputs to the piezoelectric element11 r of the transmitting device 13 r the voltage signal according to thecontrol signal. When the ultrasonic sensor 20 receives the ultrasonicwave reflected from the obstacle, the circuit device 28 receives from,for example, the piezoelectric element 11 q of the receiving device 13 qthe voltage signal corresponding to pressure and phase of the receivedultrasonic wave. The circuit device 28 generates the vibration signalaccording to the voltage signal and outputs the vibration signal to theECU.

The received signals of the receiving device 13 p, 13 q, 13 s areprocessed by the circuit device 28 in the same way as each other. As anexample, the received signal of the receiving device 13 q is processedby the circuit device 28 as follows. A block diagram of the circuitdevice 28 corresponding to a section for processing the received signalof the receiving device 13 q is illustrated in FIG. 7. Like the circuitdevice 18 of the first embodiment, the circuit device 28 includes theamplifier 21 q, the phase-locked loop 22, the distance-informationsynchronous detector 23, and the phase-information synchronous detector24.

It is noted that the circuit device 28 further includes a drive signalgenerator 26. The drive signal generator 26 includes the ultrasonictransmitter (UT) 26 a, a phase inverter (PI) 26 b, and a receptioncontroller (RC) 26 c. The ultrasonic transmitter 26 a outputs thetransmission signal St to the transmitting device 13 r, and thetransmitting device 13 r transmits an ultrasonic wave upon receipt ofthe transmission signal St. At the same time, the ultrasonic transmitter26 a outputs the transmission signal St to the time counter 23 f. Thephase inverter 26 b outputs to the reception controller 26 c a signalhaving opposite phase to the transmission signal St. The receptioncontroller 26 c outputs a drive signal Sd to the receiving device 13 qbased on the output signal of the phase inverter 26 b. In response tothe drive signal Sd, the piezoelectric elements 11 q is driven (i.e.,vibrates) such that a vibration propagating from the transmitting device13 r to the receiving device 13 q can be cancelled (i.e., removed).Further, the reception controller 26 c outputs a cut signal Sc to theamplifier 21 q during a period of time when the drive signal Sd isoutputted. While receiving the cut signal Sc, the amplifier 21 qinterrupts the received signal of the receiving device 13 q to asubsequent stage (i.e., the phase-locked loop 22 and thephase-information synchronous detector 24) of the circuit device 28.

The ultrasonic sensor 20 detects the obstacle as follows. The detectionof the position of the obstacle requires both distance information Ddand phase-difference information Dp.

The circuit device 28 receives from the ECU the control signal thatcontrols pressure and phase of an ultrasonic wave to be transmitted. Inthe circuit device 28, the ultrasonic transmitter 26 a outputs thetransmission signal St to the piezoelectric element 11 r of thetransmitting device 13 r according to the control signal. Thepiezoelectric element 11 r vibrates according to the transmission signalSt and thus emits the ultrasonic wave having the controlled pressure andphase. The emitted ultrasonic wave propagates through the acousticmatching member 12 r and is transmitted to outside of the vehiclethrough the transmitting surface 12 a.

In the drive signal generator 26, the transmission signal St isphase-inverted by the phase inverter 26 b. The phase-inverted signalhaving opposite phase to the transmission signal St is inputted to thereception controller 26 c. Then, the reception controller 26 c outputsthe drive signal Sd to the receiving device 13 q. In response to thedrive signal Sd, the piezoelectric element 11 q is driven such that thevibration propagating from the transmitting device 13 r to the receivingdevice 13 q can be cancelled. Specifically, the drive signal Sd causesthe piezoelectric element 11 q to vibrate at opposite phase to avibration that propagates from the transmitting device 13 r to thereceiving device 13 q through the vibration damper 41. The drive signalSd is described in more detail later.

The ultrasonic wave transmitted through the transmitting surface 12 a ofthe acoustic matching member 12 r is reflected from the obstacle. Thereflected ultrasonic wave is received through the receiving surfaces 12a of the acoustic matching member 12 q. The received ultrasonic wavepropagates to the piezoelectric element 11 q through the acousticmatching members 12 q. Then, the ultrasonic wave is converted to thereceived signal (voltage signal) by the piezoelectric elements 11 q.Here, it is assumed that the received signal of the reference receivingdevice 13 q is given by sin(ωt+α).

The received signal of the reference receiving device 13 q is amplifiedby the amplifier 21 q and then inputted to the phase-locked loop 22. Inthe phase-locked loop 22, the band-pass filter 22 a removes unwantedfrequency components from the received signal. An output signal of theband-pass filter 22 a is low-pass filtered by the low-pass filter 22 cand then inputted to the voltage-controlled oscillator 22 d. The phasedetector 22 b detects a phase difference between the received signal andan output signal of the voltage-controlled oscillator 22 d. The phasedifference is feedback to the voltage-controlled oscillator 22 d. Thus,the output signal of the voltage-controlled oscillator 22 d issynchronized with (i.e., locked to the frequency of) the receivedsignal.

Below, a method of obtaining the distance information Dd is described.In the distance-information synchronous detector 23, the received signalof the reference receiving device 13 q is inputted to the phasesensitive detector 23 a. The phase sensitive detector 23 a is switchedbetween an amplify (x1) and an inverter (x−1) synchronously with thefrequency-locked signal received from the phase-locked loop 22. In thisway, the phase sensitive detector 23 a performs the synchronousdetection by using the frequency-locked signal as a reference signal. Asa result of the synchronous detection, a frequency component of thereceived signal equal to a frequency of the reference signal isconverted to a DC component and passes through the low-pass filter 23 b.The other components of the received signal are converted to ACcomponents and removed by the low-pass filter 23 b.

In the distance calculation circuit 23 c, an output signal of thelow-pass filter 23 b is amplified by the amplifier 23 d and theninputted to the comparator 23 e. The comparator 23 e compares theinputted signal with the reference voltage Vref. If the voltage level ofthe inputted signal exceeds the reference voltage Vref, the comparator23 e outputs the receipt signal to the time counter 23 f. The timecounter 23 f counts clock signals CLK from when the transmission signalSt is received to when the receipt signal is received. Thus, the timecounter 23 f can accurately measure the time elapsed from when theultrasonic wave is transmitted by the transmitting device 13 r to whenthe ultrasonic wave is received by the reference receiving device 13 q.The time counter 23 f outputs to the distance calculator 23 g the clockinformation representing the number of clock signals CLK counted by thetime counter 23 f. The distance calculator 23 g calculates the distancebetween the ultrasonic sensor 20 and the obstacle based on the clockinformation and outputs the distance information Dd corresponding to thecalculated distance.

Below, a method of obtaining the phase difference information Dp isdescribed below. The received signal of the receiving device 13 q isamplified by the amplifier 21 p and then inputted to thephase-information synchronous detector 24. In the phase-informationsynchronous detector 24, the received signal is inputted to the firstphase sensitive detector 24 a. The first phase sensitive detector 24 ais switched between an amplify (x1) and an inverter (x−1) synchronouslywith the frequency-locked signal. In this way, the first phase sensitivedetector 24 a performs the synchronous detection by using thefrequency-locked signal as a reference signal.

Further, in the phase-information synchronous detector 24, the receivedsignal is inputted to the second phase sensitive detector 24 b. Thesecond phase sensitive detector 24 b is switched between an amplify (x1)and an inverter (x−1) synchronously with a π/2-phase-shifted signal thatis phase-shifted by π/2 from the frequency-locked signal. In this way,the second phase sensitive detector 24 b performs the synchronousdetection by using the π/2-phase-shifted signal as a reference signal.

The synchronous detection performed by the first phase sensitivedetector 24 a is described in detail below. Here, it is assumed that thefrequency-locked signal outputted from the phase-locked loop 22 is givenby sin(ωt+α). In the first phase sensitive detector 24 a, the receivedsignal is given by sin(ωt+β), and the reference signal is given bysin(ωt+α). The following equation is obtained by multiplying thereceived signal of sin(ωt+β) by the reference signal of sin(ωt+α).

sin(ωt+β)sin(ωt+α)=−½ cos(2ωt+α+β)+½ cos(β−α)   (3)

Thus, the first low-pass filter 24 c removes the first term “−½cos(2ωt+α+β)” of the equation (3) and passes the second term “½cos(β−α)” of the equation (3).

Next, the synchronous detection performed by the second phase sensitivedetector 24 b is described in detail below. The second phase sensitivedetector 24 b performs the synchronous detection using theπ/2-phase-shifted signal as a reference signal.

In the second phase sensitive detector 24 b, the received signal isgiven by sin(ωt+β), and the reference signal is given by cos(ωt+α). Thefollowing equation is obtained by multiplying the received signal ofsin(ωt+β) by the reference signal of cos(ωt+α).

sin(ωt+β)cos(ωt+α)=½ sin(2ωt+α+β)+½ sin(β−α)   (4)

Therefore, the low-pass filter 24 d removes the first term “½sin(2ωt+α+β)” of the equation (4) and passes the second term “½sin(β−α)” of the equation (4).

Each of the output signals of the low-pass filters 24 c, 24 d depend ona phase “α”. The output signals of the low-pass filters 24 c, 24 d areinputted to the angle calculator 24 e. The angle calculator 24 ecalculates tan(β−α) by using the output signals of the low-pass filters24 c, 24 d. In such an approach, the phase difference “β−α” can becalculated without influence of the amplitude of the received signal onthe phase difference “β−α”. The tan(β−α) is outputted as the phasedifference information Dp.

In this way, the received signal of the receiving device 13 q isprocessed by the circuit device 28 to obtain the distance information Ddand the phase difference information Dp. The received signals of thereceiving devices 13 p, 13 s are processed by the circuit device 28 inthe same way as the received signal of the receiving device 13 q so thatthe distance information Dd and the phase information Dp can beobtained. Therefore, the position of the obstacle can be measured basedon the obtained information Dd, Dp and distances between the receivingdevices 13 q, 13 p, 13 s. Since the receiving devices 13 p, 13 q, 13 sare arranged in an array, the ultrasonic sensor 20 can accurately detectthe phase differences corresponding to the position of the obstacle overa wide range of area.

Below, the drive signal Sd outputted from the drive signal generator 26is described in detail with reference to FIGS. 8-10B.

FIG. 8 illustrates a relationship between a noise change rate and aphase difference between the drive signal Sd applied to the receivingdevice 13 q and a vibration noise Sn prorogating from the transmittingdevice 13 r to the receiving device 13 p. As can be seen from FIG. 8,when the drive signal Sd has an opposite phase to the vibration noiseSn, the vibration noise Sn is at a minimum. Further, FIG. 8 indicatesthat when the phase difference between the drive signal Sd and thevibration noise Sn ranges from about 110 degrees to about 250 degrees,the vibration noise Sn is reduced by the drive signal Sd. Therefore, itis preferable that the drive signal Sd be controlled such that the phasedifference between the drive signal Sd and the vibration noise Sn rangesfrom about 110 degrees to about 250 degrees.

As shown in FIG. 9A, the vibration noise Sn has the same number ofcontinuous waves as the transmission signal St. The drive signal Sd canbe applied to the receiving device 13 p even before the vibration noiseSn propagates to the receiving device 13 p. Further, the application ofthe drive signal Sd to the receiving device 13 p can continue for apredetermined time period even after the propagation of the vibrationnoise Sn to the receiving device 13 p is ended.

FIG. 9B illustrates a relationship between the vibration noise changerate and the number of waves of the drive signal Sd that is applied tothe receiving device 13 q before the vibration noise Sn propagates tothe receiving device 13 q. As can be seen from FIG. 9B, when at most twowaves of the drive signal Sd are applied to the receiving device 13 qbefore the start of the propagation of the vibration noise Sn to thereceiving device 13 q, the vibration noise Sn is effectively reduced bythe drive signal Sd. Therefore, it is preferable that at most two wavesof the drive signal Sd be applied to the receiving device 13 q beforethe start of the propagation of the vibration noise Sn to the receivingdevice 13 q.

FIG. 9C illustrates a relationship between the vibration noise changerate and the number of waves of the drive signal Sd that is applied tothe receiving device 13 q after the propagation of the vibration noiseSn to the receiving device 13 q is ended. As can be seen from FIG. 9C,when at most two waves of the drive signal Sd are applied to thereceiving device 13 q after the end of the propagation of the vibrationnoise Sn to the receiving device 13 q, the vibration noise Sn iseffectively reduced by the drive signal Sd. Therefore, it is preferablethat at most two waves of the drive signal Sd be applied to thereceiving device 13 q after the end of the propagation of the vibrationnoise Sn to the receiving device 13 q.

Further, FIG. 9C indicates that even when the application of the drivesignal Sd to the receiving device 13 q is ended at a time when the lastwave of the vibration noise vibration Sn propagates to the receivingdevice 13 q, the vibration noise vibration Sn is not increased. In otherwords, the last wave of the drive signal Sd can be applied to thereceiving device 13 q when the second last wave of the vibration noiseSn propagates to the receiving device 13 q.

FIG. 10A illustrates magnitudes of the transmission signal St, thevibration noise Sn, and the drive signal Sd. As shown in FIG. 10A, amagnitude Sn1 of the vibration noise Sn is smaller than a magnitude St1of the transmission signal St.

FIG. 10B illustrates a relationship between the vibration noise changerate and a ratio of a magnitude Sd1 of the drive signal Sd to themagnitude Sn1 of the vibration noise Sn. As can be seen from FIG. 10B,when the ratio of the magnitude Sd1 to the magnitude Sn1 ranges from 50percent to 100 percent, the vibration noise Sn is reduced by the drivesignal Sd. Therefore, it is preferable that the ratio of the magnitudeSd1 to the magnitude Sn1 range from 50 percent to 100 percent.

As described above, according to the second embodiment, the ultrasonicsensor 20 can have the following advantages.

(1) The ultrasonic sensor 20 includes the circuit device 28 having thedrive signal generator 26. The drive signal generator 26 outputs thedrive signal Sd to the piezoelectric elements 11 q, 11 p, 11 s of thereceiving devices 13 q, 13 p, 13 s based on the transmission signal Stoutputted from the transmitting device 13 r. The drive signal Sd causesthe piezoelectric elements 11 q, 11 p, 11 s to vibrate at opposite phaseto the vibration that propagates from the transmitting device 13 r tothe receiving devices 13 q, 13 p, 13 s through the vibration damper 41.Thus, the vibration propagating from the transmitting device 13 r to thereceiving devices 13 q, 13 p, 13 s can be cancelled.

(2) It is preferable that the drive signal Sd be controlled such thatthe phase difference between the drive signal Sd and the vibration noiseSn range from about 110 degrees to about 250 degrees. In such anapproach, the vibration noise Sn can be effectively reduced by the drivesignal Sd.

It is preferable that at most two waves of the drive signal Sd beapplied to the receiving devices 13 p, 13 q, 13 r before the start ofthe propagation of the vibration noise Sn to the receiving devices 13 p,13 q, 13 r. In such an approach, the vibration noise Sn can beeffectively reduced by the drive signal Sd.

It is preferable that at most two waves of the drive signal Sd beapplied to the receiving devices 13 p, 13 q, 13 r after the end of thepropagation of the vibration noise Sn to the receiving device 13 q.Further, it is acceptable that the last wave of the drive signal Sd beapplied to the receiving device 13 p, 13 q, 13 r when the second lastwave of the vibration noise Sn propagates to the receiving device 13 q.

It is preferable that the ratio of the magnitude Sd1 of the drive signalSd to the magnitude Sn1 of the vibration noise Sn range from 50 percentto 100 percent. In such an approach, the vibration noise Sn can beeffectively reduced by the drive signal Sd.

Modification of Second Embodiment

The second embodiment described above can be modified, for example, asfollows.

(1) For example, when the receiving device 13 q receives the ultrasonicwave reflected from the obstacle, the acoustic matching member 12 qvibrates accordingly. The piezoelectric elements 11 q may detect notonly a first vibration of the acoustic matching member 12 qcorresponding to the received ultrasonic wave but also a secondvibration of the acoustic matching member 12 q caused by thereverberation of the first vibration. The second vibration detected bythe piezoelectric elements 11 q may result in an error. The drive signalgenerator 26 can be configured to prevent this problem. Specifically,the second vibration is inputted to the drive signal generator 26through the amplifier 21 q, and the drive signal generator 26 generatesthe drive signal Sd based on the second vibration.

(2) As shown in FIG. 11, the ultrasonic sensor 20 can include a set ofan amplifier 21 m and a dummy device 13 m instead of the drive signalgenerator 26. The dummy device 13 m merely detects a vibrationpropagating from the transmitting device 13 r. The vibration detected bythe dummy device 13 m is amplified by the amplifier 21 m, and theamplifier 21 m outputs a dummy vibration signal. In the circuit device28, the dummy vibration signal is subtracted from the received signal ofthe receiving device 13 q to cancel a vibration propagating from thetransmitting device 13 r to the receiving device 13 q. Thus, like thedrive signal generator 26, the amplifier 21 m and the dummy device 13 mwork in conjunction with each other to cancel the vibration noise.

For example, the dummy device 13 m can be formed by covering thereceiving surface 12 a of one receiving device with a covering material(e.g., rubber) that can interrupt the ultrasonic wave. Alternatively,the dummy device 13 m can be formed by placing one receiving deviceinside the vibration damper 41 near the receiving device 13 q. By theway, even when the receiving device 13 q and the dummy device 13 m havedifferent sensitivities, the difference in sensitivities between thereceiving device 13 q and the dummy device 13 m can be corrected byadjusting the amplifiers 21 q, 21 m.

Third Embodiment

An ultrasonic sensor 30 according to a third embodiment of the presentinvention is described below with reference to FIGS. 12A, 12B, and 13.

As shown in FIGS. 12A and 12B, the ultrasonic sensor 30 includes foursensor devices 13 p-13 s arranged in an array of two rows and twocolumns, a circuit device 38 electrically coupled to the sensor devices13 p-13 s, and the housing 31 for accommodating the sensor devices 13p-13 s and the circuit device 38.

The sensor device 13 r serves as a transmitting device for transmittingan ultrasonic wave. The sensor device 13 q is located diagonally to thetransmitting device 13 r and serves a reference receiving device. Thesensor device 13 p is located adjacent to the reference receiving device13 q in a horizontal direction and serves as a receiving device (i.e.,non-reference receiving device). The sensor device 13 r is locatedadjacent to the reference receiving device 13 q in a vertical directionand serves as a receiving device (i.e., non-reference receiving device).That is, like the first embodiment, the ultrasonic sensor 30 has areference receiving element.

Further, like the second embodiment, the circuit device 38 of theultrasonic sensor 30 has the drive signal generator 26 that outputs thedrive signal Sd and the cut signal Sc.

In summary, the third embodiment corresponds to a combination of thefirst and second embodiments. Therefore, according to the thirdembodiment, the ultrasonic sensor 30 can have the advantages describedin the first and second embodiments.

Fourth Embodiment

An ultrasonic sensor 110 according to a fourth embodiment of the presentinvention is described below with reference to FIGS. 14A and 14B. Likethe ultrasonic sensors 10-30 described in the preceding embodiments, forexample, the ultrasonic sensor 110 can be used as an obstacle sensormounted on a vehicle.

The ultrasonic sensor 110 includes a transmitting device 111, receivingdevices 112 p, 112 q, 112 r, a vibration damper 118, a first absorber119, a vibration isolator 190, and a housing 131. The transmittingdevice 111 transmits an ultrasonic wave. The receiving devices 112 p,112 q, 112 r detect the ultrasonic wave reflected from the obstacle. Thevibration damper 118 prevents propagation (i.e., vibration noise) of theultrasonic wave among the transmitting device 111 and the receivingdevices 112 p, 112 q, 112 r. The first absorber 119 protects thetransmitting device 111 and the receiving devices 112 p, 112 q, 112 rfrom external force (impact) applied to the ultrasonic sensor 110. Thevibration isolator 190 isolates the transmitting device 111 from thereceiving devices 112 p, 112 q, 112 r to prevent propagation of theultrasonic wave from the transmitting device 111 to the receivingdevices 112 p, 112 q, 112 r. The housing 131 is shaped like a box havingan opening. The transmitting device 111, the receiving devices 112 p,112 q, 112 r, the vibration damper 118, the first absorber 119, and thevibration isolator 190 are accommodated in the housing 131.

The receiving devices 112 p, 112 q, 112 r are identical in structure. Inan example below, the structure of the receiving device 112 p isdescribed. The receiving device 112 p includes an acoustic matchingmember 113 p and a piezoelectric element 114 p joined to the acousticmatching member 113 p. The acoustic matching member 113 p receives theultrasonic wave reflected from the obstacle and allows the ultrasonicwave to propagate to the piezoelectric element 114 p. Thus, thepiezoelectric element 114 p detects the ultrasonic wave.

The piezoelectric element 114 p can be made of, for example,piezoelectric zirconate titanate (PZT). The piezoelectric element 114 pincludes a piezoelectric body and a pair of electrodes 115 p. Thepiezoelectric body has a rectangular cylindrical shape and is identicalin cross-section to the acoustic matching member 113 p. The electrodes115 p are respectively formed on opposite surfaces of the piezoelectricbody in an ultrasonic propagation direction. That is, the piezoelectricbody is sandwiched between the electrodes 115 p. For example, theelectrodes 115 p can be formed by plating or sputtering of platinum(Pt), copper (Cu), or silver (Ag) or by baking of conductive paste.

The acoustic matching member 113 p is made of a material having anacoustic impedance that is greater than an acoustic impedance of air andless than an acoustic impedance of the piezoelectric element 114 p. Forexample, the acoustic matching member 113 p can be made of a highdurability resin material such as a polycarbonate resin.

A thickness t of the acoustic matching member 113 p is substantiallyequal to one-quarter the wavelength of the ultrasonic wave in theacoustic matching member 113 p. In such an approach, a standing wave isproduced in the acoustic matching member 113 p. Therefore, interferenceand cancellation between the ultrasonic wave entering the acousticmatching member 113 p and the ultrasonic wave reflected at an interfacebetween the piezoelectric element 114 p and the acoustic matching member113 p can be reduced. As a result, the ultrasonic wave entering theacoustic matching member 113 p can efficiently propagate to thepiezoelectric element 114 p. It is preferable that a width w of theacoustic matching member 113 p be substantially equal to or less thanone-half the wavelength of the ultrasonic wave in air.

The transmitting device 111 includes an acoustic matching member 113 anda multilayer piezoelectric element 116 joined to the acoustic matchingmember 113. The acoustic matching member 113 has the same structure asthe acoustic matching member 113 p.

The multilayer piezoelectric element 116 can be made of, for example,piezoelectric zirconate titanate (PZT). The multilayer piezoelectricelement 116 includes a piezoelectric body and a pair of comb electrodes117. The piezoelectric body has a rectangular cylindrical shape and isidentical in cross-section to the acoustic matching member 113. The combelectrodes 117 are formed to the piezoelectric body such thatpiezoelectric layers are interleaved with electrode layers. The numberof layers can vary according to pressure of the ultrasonic wave to betransmitted. As the number of layers increases, pressure of theultrasonic wave transmitted by the multilayer piezoelectric element 116increases.

The electrodes 115 p of the piezoelectric element 114 p are electricallycoupled to a circuit device through wires 114 a. The comb electrodes 117of the multilayer piezoelectric element 116 are electrically coupled tothe circuit device through wires 117 a. The circuit device iselectrically coupled to the ECU (not shown) of the vehicle. Although thecircuit device is not shown in the drawings, the ultrasonic sensor 110can include, for example, one of the circuit devices 18, 28, 38described in the preceding embodiments.

The acoustic matching members 113, 113 p-113 r are arranged in an arraythrough the vibration damper 118. It is preferable that a distance dbetween centers of adjacent acoustic matching members be substantiallyequal to one-half the wavelength of the ultrasonic wave.

The vibration damper 118 is fixed to the opening of the housing 131 tocover receiving surfaces 113 j of the acoustic matching members 113p-113 r and a transmitting surface 113 s of the acoustic matching member113. That is, the receiving surfaces 113 j and the transmitting surface113 s are not exposed outside the housing 131. The vibration damper 118prevents foreign matters such as water and dust from entering inside thehousing 131. Therefore, reliability of the ultrasonic sensor 110 can beimproved. The housing 131 is mounted to the vehicle such that theacoustic matching members 113, 113 p-113 r can face outside the vehicle.For example, the housing 131 is mounted to the bumper 51 of the vehicle.

The vibration damper 118 is made of a material that has a dampingconstant higher than a damping constant of each of the acoustic matchingmembers 113, 113 p-113 r and that has an acoustic impedance less than anacoustic impedance of each of the acoustic matching members 113, 113p-113 r. For example, the vibration damper 118 can be made of siliconerubber. Also, the vibration damper 118 can be made of a material havinga low elastic modulus and a low density. For example, a foam materialsuch as resin foam, foam rubber, or sponge rubber can be suitably usedas a material for the vibration damper 118. Since the vibration damper118 made of such a material is located among the acoustic matchingmembers 113, 113 p-113 r, the propagation of the ultrasonic wave amongthe acoustic matching members 113, 113 p-113 r can be prevented.Accordingly, vibration noise originating from the propagation can beprevented.

In the fourth embodiment, the vibration damper 118 has the thickness ofone millimeter (i.e., 1 mm) or less at a portion covering the receivingsurfaces 113 j and the transmitting surface 113 s. In such an approach,the ultrasonic wave can be suitably transmitted and received through thevibration damper 118.

The first absorber 119 is made of a material having an elastic modulusless than an elastic modulus of each of the piezoelectric element 114 pand the multilayer piezoelectric element 116. For example, the firstabsorber 119 can be made of a high-polymer material. Specifically, thefirst absorber 119 can be made of soft resin such as urethane, or apotting material such as rubber or silicon, or the like. The firstabsorber 119 is located between the housing 131 and each of themultilayer piezoelectric element 116 of the transmitting device 111, thepiezoelectric element 114 p of the receiving device 112 p, andpiezoelectric elements (not shown) of the receiving devices 112 q, 112r. Each piezoelectric element is surrounded by the first absorber 119.

Even when impact force is applied to the transmitting device 111 and thereceiving devices 112 p-112 r, for example, by a small stone hit againstthe vibration damper 118 during running of the vehicle, the firstabsorber 119 absorbs the impact force. Further, the first absorber 119helps prevent the transmitting device 111 and the receiving devices 112p-112 r from being displaced toward a bottom 131 a of the housing 131.In this way, the first absorber 119 protects the transmitting device 111and the receiving devices 112 p-112 r from the impact force. Further,since each piezoelectric element is surrounded by the first absorber119, each piezoelectric element can be surely protected fromenvironmental factors such as water and dust. Accordingly, thereliability of the ultrasonic sensor 110 can be improved.

The vibration isolator 190 is shaped like a plate and made of a materialhaving a higher elastic modulus and a higher acoustic impedance than thefirst absorber 119. The vibration isolator 190 is located between thetransmitting device 111 and each of the receiving devices 112 p, 112 r,which are located adjacent to the transmitting device 111. The vibrationisolator 190 stands on the bottom 131 a of the housing 131 to partitionan inner space of the housing 131. As shown in FIG. 14A, thetransmitting device 111 is enclosed with the vibration isolator 190 anda side wall of the housing 31. Thus, the transmitting device 111 isisolated by the vibration isolator 190 from the receiving devices 112p-112 r. The vibration isolator 190 is fixed to the vibration damper 118at one end and fixed to the first absorber 119 at the other end. Thethickness of the vibration isolator 190 is determined to suitably reducethe propagation of the ultrasonic wave from the multilayer piezoelectricelement 116 to the acoustic matching members 113 p-113 r. Further, thethickness of the vibration isolator 190 is determined to suitably reduceinterference of the vibration isolator 190 with the acoustic matchingmembers 113 p-113 r at the vibration damper 118.

The ultrasonic sensor 110 detects the obstacle as follows. Firstly, thecircuit device of the ultrasonic sensor 110 receives from the ECU of thevehicle a control signal for controlling pressure and phase of anultrasonic wave to be transmitted. The circuit device outputs a voltagesignal to the multilayer piezoelectric element 116 according to thecontrol signal. The multilayer piezoelectric element 116 vibratesaccording to the control signal so as to emit the ultrasonic wave havingthe controlled pressure and phase.

In the fourth embodiment, the multilayer piezoelectric element 116 has afive-layered structure. Therefore, pressure of the ultrasonic waveemitted by the multilayer piezoelectric element 116 can be five timesgreater than that of the ultrasonic wave emitted by a single-layerpiezoelectric element. Thus, the multilayer piezoelectric element 116can emit the ultrasonic wave of high pressure.

The vibration isolator 190, which isolates the transmitting device 111from the receiving devices 112 p-112 r, has the higher elastic modulusand the higher acoustic impedance than the first absorber 119.Therefore, the ultrasonic wave emitted by the multilayer piezoelectricelement 116 is reflected at an interface between the first absorber 119and the vibration isolator 190. In this way, although pressure of theultrasonic wave emitted by the multilayer piezoelectric element 116 ishigh, the vibration isolator 190 can suitably reduce the propagation ofthe ultrasonic wave from the transmitting device 111 to the receivingdevices 112 p-112 r. Accordingly, the vibration noise originating fromthe propagation can be reduced.

The ultrasonic wave emitted by the multilayer piezoelectric element 116propagates through the acoustic matching member 113 and is thentransmitted through the transmitting surface 113 s. The transmittedultrasonic wave is reflected from the obstacle and received through thereceiving surfaces 113 j of the acoustic matching members 113 p-113 r.For example, the ultrasonic wave received through the receiving surface113 j of the acoustic matching member 113 p propagates through theacoustic matching member 113 p to the piezoelectric element 114 p and isconverted to a voltage signal by the piezoelectric element 114 p. Thepiezoelectric element 114 p outputs the voltage signal to the circuitdevice. The circuit device processes the voltage signal and outputs theprocessed signal to the ECU.

For example, the distance between the ultrasonic sensor 110 and theobstacle can be measured based on a time elapsed from when theultrasonic wave is transmitted to when the ultrasonic wave is received.Further, since the receiving devices 112 p-112 r are arranged in anarray, the position of the obstacle can be detected based on a timedifference or a phase difference between the ultrasonic waves receivedby the receiving devices 112 p-112 r.

The vibration damper 118 is interposed among the acoustic matchingmembers 113 p-113 r. The ultrasonic wave is divided by the acousticmatching members 113 p-113 r. The divided ultrasonic waves propagate tothe receiving devices 112 p-112 r through the acoustic matching members113 p-113 r, respectively. Therefore, good crosstalk characteristics areachieved so that the ultrasonic sensor 110 can accurately detect theultrasonic wave.

Modification of Fourth Embodiment

The fourth embodiment can be modified, for example, as follows. Theacoustic matching members 113, 113 p-113 r can be fixed by the vibrationdamper 118 to the housing 131 at side surfaces near the receivingsurfaces 113 j and the transmitting surface 113 s such that thereceiving surfaces 113 j and the transmitting surface 113 s are exposedoutside. In this case, a coating or the like can be applied to theexposed receiving surfaces 113 j and transmitting surface 113 s.

The vibration isolator 190 can be integrally formed with the housing131. That is, the housing 131 and the vibration isolator 190 can beformed as a single piece. In such an approach, the number of parts ofthe ultrasonic sensor 110 can be reduced, and the vibration isolator 190can be accurately positioned in the housing 131.

As shown in FIG. 15, the vibration damper 118, the housing 131, and thevibration isolator 190 can be joined together by a joint 118 a. In suchan approach, the transmitting device 111 and the receiving devices 112p-112 r can be accurately positioned with respect to the housing 131 andthe vibration isolator 190. For example, the joint 118 a can be formedby a two-color (two-material) molding method, a thermocompressionbonding method, a laser welding method, a vulcanization bonding method,an adhesive agent, or the like.

The vibration isolator 190 can have a smaller thickness on the acousticmatching member side than on the piezoelectric element side. Forexample, as shown in FIG. 16, the vibration isolator 190 can betrapezoidal in cross section. In such an approach, the interference ofthe vibration isolator 190 to the acoustic matching members 113 p-113 rat the vibration damper 118 can be reduced, and strength of thevibration isolator 190 can be increased. For another example, thevibration isolator 190 can be formed with two plates joined togethersuch that the vibration isolator 190 can have a step shape in crosssection.

The vibration isolator 190 can have a layer structure in which a softmaterial is sandwiched between solid materials. For example, as shown inFIG. 17, the vibration isolator 190 can be constructed with metal plates190 b and a resin layer 190 a sandwiched between the metal plates 190 b.In such an approach, even when the ultrasonic wave is not reflected bythe metal plates 190 b, the resin layer 190 a damps the ultrasonic wavepassing through the metal plates 190 b. Thus, the vibration noiseoriginating from the propagation of the ultrasonic wave from thetransmitting device 111 to the receiving devices 112 p-112 r can bereduced.

The shape of the first absorber 119 can vary depending on the intendeduse. For example, the first absorber 119 can be formed only between thebottom 131 a of the housing 131 and each of the piezoelectric elementsof the transmitting device 111 and the receiving devices 112 p-112 r.Alternatively, the inner space of the housing 131 can be filled with thefirst absorber 119.

The acoustic matching member 113, 113 p-113 r can have a shape other arectangular cylinder with a squire cross section. For example, theacoustic matching members 113, 113 p-113 r can have a circular cylinderwith a circular cross section. In such an approach, unwanted vibrationsin the acoustic matching members 113, 113 p-113 r can be suitablyreduced.

The number and arrangement of the transmitting device and the receivingdevices can vary depending on the intended use. For example, when theultrasonic sensor 110 is designed to measure the distance, theultrasonic sensor 110 needs at least one transmitting device and onereceiving device. For another example, when the ultrasonic sensor 110 isdesigned to measure the direction, the ultrasonic sensor 110 needs atleast one transmitting device and two receiving devices.

Like the transmitting device 111, the receiving devices 112 p-112 r canhave a multilayer structure.

As described above, according to the fourth embodiment, the ultrasonicsensor 110 can have the following advantages.

(1) The transmitting device 111 employs the multilayer piezoelectricelement 116. Therefore, the transmitting device 111 can transmit theultrasonic wave of high pressure. Since the transmitting device 111 isisolated from the receiving devices 112 p-112 r by the vibrationisolator 190, the vibration noise originating from the propagation ofthe ultrasonic wave from the transmitting device 111 to the receivingdevices 112 p-112 r can be reduced. Thus, the ultrasonic sensor 110 canachieve both high pressure ultrasonic wave and low vibration noise.

(2) The first absorber 119 protects the transmitting device 111 and thereceiving devices 112 p-112 r from the external force applied to theultrasonic sensor 110. Since the vibration isolator 190 has the higheracoustic impedance than the first absorber 119, the ultrasonic waveemitted by the multilayer piezoelectric element 116 is reflected at theinterface between the first absorber 119 and the vibration isolator 190.Thus, even when the emitted ultrasonic wave has high pressure, thevibration isolator 190 can suitably reduce the propagation of theultrasonic wave from the transmitting device 111 to the receivingdevices 112 p-112 r. Accordingly, the vibration noise originating fromthe propagation can be reduced.

(3) The vibration isolator 190 can be integrally formed with the housing131. In such an approach, the number of parts of the ultrasonic sensor110 can be reduced, and the vibration isolator 190 can be accuratelypositioned in the housing 131.

(4) The vibration isolator 190 can have a smaller thickness on theacoustic matching member side than on the piezoelectric element side. Insuch an approach, the interference of the vibration isolator 190 to theacoustic matching members 113 p-113 r at the vibration damper 118 can bereduced, and the strength of the vibration isolator 190 can beincreased.

(5) The vibration isolator 190 can have a layer structure in which asoft material is sandwiched between solid materials. In such anapproach, even when the ultrasonic wave emitted by the transmittingdevice 111 is not reflected by the solid materials, the soft materialdamps the ultrasonic wave passing through the solid materials. Thus, thevibration noise originating from the propagation of the ultrasonic wavecan be reduced.

(6) The transmitting surface 113 s and the receiving surfaces 113 j arecovered with the vibration damper 118. In such an approach, thetransmitting device 111 and the receiving devices 112 p-112 r can besurely protected from environmental factors such as water and dust.Accordingly, the reliability of the ultrasonic sensor 110 can beimproved.

Fifth Embodiment

An ultrasonic sensor 120 according to a fifth embodiment of the presentinvention is described below with reference to FIG. 18. Differencesbetween the fourth and fifth embodiments are as follows.

As shown in FIG. 18, the ultrasonic sensor 120 has a second absorber 121in addition to the first absorber 119. The second absorber 121 is madeof a material having a lower elastic modulus and a lower acousticimpedance than the first absorber 119. For example, the second absorber121 can be made of gel. The first absorber 119 is placed between thebottom 131 a of the housing 131 and each of the piezoelectric elementsof the transmitting device 111 and the receiving devices 112 p-112 r.The second absorber 121 is placed on the first absorber 119 to surroundthe piezoelectric elements of the transmitting device 111 and thereceiving devices 112 p-112 r.

Even when the external force is applied to the transmitting device 111and the receiving devices 112 p-112 r through the vibration damper 118,the first absorber 119 absorbs the external force. Since eachpiezoelectric element is surrounded by the second absorber 121, eachpiezoelectric element can be surely protected from environmental factorssuch as water and dust. Accordingly, the reliability of the ultrasonicsensor 110 can be improved. Further, since the second absorber 121placed near the acoustic matching members 113, 113 p-113 r has the lowerelastic modulus than the first absorber 119, the damping of theultrasonic wave in the acoustic matching members 113, 113 p-113 r can bereduced.

Modification of Fifth Embodiment

The fifth embodiment can be modified, for example, as follows. Anabsorber placed between the bottom 131 a of the housing 131 and each ofthe receiving devices 112 p-112 r can have an elastic modulus differentthan that of an absorber placed between the bottom 131 a and thetransmitting device 111. Specifically, as shown in FIG. 19, a thirdabsorber 122 can be placed between the multilayer piezoelectric element116 and the bottom 131 a. The third absorber 122 has a higher elasticmodulus than the first absorber 119. In such an approach, the multilayerpiezoelectric element 116 can effectively emit the ultrasonic wave.

Further, as shown in FIG. 20, the third absorber 122 can have a greaterheight, measured from the bottom 131 a, than the first absorber 119. Insuch an approach, a lateral vibration of the multilayer piezoelectricelement 116 is restricted so that the multilayer piezoelectric element116 can effectively emit the ultrasonic wave.

As described above, according to the fifth embodiment, the ultrasonicsensor 120 can have the following advantages.

(1) The ultrasonic sensor 120 has the second absorber 121 in addition tothe first absorber 119. The second absorber 121 has the lower elasticmodulus than the first absorber 119. The first absorber 119 is placedbetween the bottom 131 a of the housing 131 and each of thepiezoelectric elements of the transmitting device 111 and the receivingdevices 112 p-112 r. The second absorber 121 is placed on the firstabsorber 119 to surround the piezoelectric elements of the transmittingdevice 111 and the receiving devices 112 p-112 r. The external forceapplied to the transmitting device 111 and the receiving devices 112p-112 r through the vibration damper 118 can be absorbed by the firstabsorber 119. The piezoelectric elements are surrounded by the secondabsorber 121 so that the piezoelectric elements can be protected fromenvironmental factors such as water and dust. Since the second absorber121 has the lower elastic modulus than the first absorber 119, thedamping of the ultrasonic wave in the acoustic matching members 113, 113p-113 r can be reduced.

(2) The third absorber 122 can be placed between the multilayerpiezoelectric element 116 and the bottom 131 a. Since the third absorber122 has the higher elastic modulus than the first absorber 119, themultilayer piezoelectric element 116 can effectively emit the ultrasonicwave.

(3) The third absorber 122 can have the height greater than that of thefirst absorber 119. In such an approach, the lateral vibration of themultilayer piezoelectric element 116 is restricted so that themultilayer piezoelectric element 116 can effectively emit the ultrasonicwave.

Sixth Embodiment

An ultrasonic sensor 130 according to a sixth embodiment of the presentinvention is described below with reference to FIG. 21A. Differencesbetween the fourth and sixth embodiments are as follows.

As shown in FIG. 21A, the ultrasonic sensor 130 includes twotransmitting devices 111 a, 111 b and two receiving devices 112 q, 112r. The receiving devices 112 q, 112 r are arranged side by side in thehorizontal direction. The transmitting devices 111 a, 111 b are locatedbelow the receiving devices 112 q, 112 r and arranged side by side inthe horizontal direction. The transmitting devices 111 a, 111 b areisolated from the receiving devices 112 q, 112 r by the vibrationisolator 190 so that the propagation of the ultrasonic wave from thetransmitting devices 111 a, 111 b to the receiving devices 112 q, 112 rcan be reduced.

An acoustic matching member 113 a of the transmitting device 111 a has arectangular cross section having a length (i.e., long side) in thehorizontal direction and a width (i.e., short side) in a verticaldirection. Therefore, the transmitting device 111 a has a largerdirectivity in the vertical direction.

On the other hand, an acoustic matching member 113 b of the transmittingdevice 111 b has a rectangular cross section having a length in thevertical direction and a width in the horizontal direction. Therefore,the transmitting device 111 b has a larger directivity in the horizontaldirection.

In summary, the transmitting devices 111 a, 111 b have differentdirectivities. The ultrasonic sensor 130 can switch between thetransmitting devices 111 a, 111 b according to road conditions, forexample. In the sixth embodiment, the transmitting devices 111 a, 111 balternately transmit the ultrasonic wave. When the transmitting device111 a transmits the ultrasonic wave, the ultrasonic sensor 130 candetect the obstacle near the ground (i.e., road surface). When thetransmitting device 111 b transmits the ultrasonic wave, the ultrasonicsensor 130 can detect the obstacle over a wide horizontal range of area.

When the road conditions are bad, the ultrasonic wave reflected from theroad surface is large. Therefore, when the road conditions are bad, theultrasonic sensor 130 may not detect the obstacle based on theultrasonic wave transmitted by the transmitting device 111 a, which hasthe vertical directivity. In such a case, the ultrasonic sensor 130 maydetect the obstacle based on the ultrasonic wave transmitted by thetransmitting device 111 b, which has the horizontal directivity.Conversely, the ultrasonic sensor 130 may detect the obstacle based onthe ultrasonic wave transmitted by the transmitting device 111 a, whenthe ultrasonic sensor 130 cannot detect the obstacle based on theultrasonic wave transmitted by the transmitting device 111 b. In thisway, the transmitting devices 111 a, 111 b work complementarily to eachother so that the ultrasonic sensor 130 can detect the obstacle withhigh sensitivity over a wide range of area.

Modification of Six Embodiment

The sixth embodiment can be modified, for example, as follows. As shownin FIG. 21B, the receiving devices 112 q, 112 r can have differentdirectivities. An acoustic matching member 113 q of the receiving device112 q has a rectangular cross section having a length in the horizontaldirection and a width in the vertical direction. Therefore, thereceiving device 112 q has a larger directivity in the verticaldirection. On the other hand, an acoustic matching member 113 r of thereceiving device 112 r has a rectangular cross section having a lengthin the vertical direction and a width in the horizontal direction.Therefore, the receiving device 112 r has a larger directivity in thehorizontal direction. The ultrasonic sensor 130 can switch between thereceiving devices 112 q, 112 r according to road conditions, forexample.

The number and arrangement of the transmitting devices and receivingdevices can vary depending on the intended use.

As described above, according to the ultrasonic sensor 130 of the sixthembodiment, a set of transmitting devices or a set of receiving deviceshave different directivities. Therefore, the ultrasonic sensor 130 candetect the obstacle with high sensitivity over a wide range by changingthe directivities according to conditions such as road conditions.

Seventh Embodiment

An ultrasonic sensor 140 according to a fourth embodiment of the presentinvention is described below with reference to FIG. 22. Differencesbetween the fourth and seventh embodiments are as follows.

As shown in FIG. 22, the ultrasonic sensor 140 has a vibration isolator191 instead of the vibration isolator 190. The vibration isolator 191includes a first plate 191 a, a second plate 191 b, and a core layer 191c sandwiched between the first and second plates 191 a, 191 b. Each ofthe first and second plates 191 a, 191 b has a higher acoustic impedancethan the core layer 191 c.

Therefore, an acoustic impedance difference is large at an interfacebetween the first plate 191 a and the core layer 191 c and at aninterface between the second plate 191 b and the core layer 191 c. Thus,the ultrasonic wave from the transmitting device 111 is easily reflectedat each interface so that the propagation of the ultrasonic wave fromthe transmitting device 111 to the receiving devices 112 p-112 r can bereduced.

Modification of Seventh Embodiment

The seventh embodiment can be modified, for example, as follows. Asshown in FIG. 23, the ultrasonic sensor 140 can have a vibrationisolator 192 instead of the vibration isolator 191. The vibrationisolator 192 includes a first plate 192 a and a second plate 192 b. Thefirst plate 192 a and the second plate 192 b are joined together suchthat a sealed space 192 c can be provided between the first plate 192 aand the second plate 192 b. The sealed space 192 c is filled with asealed member 192 d. Each of the first and second plates 192 a, 192 bhas a higher acoustic impedance than the sealed member 192 d. Forexample, as shown in FIG. 23, the first plate 192 a has projections thatare in contact with the second plate 192 b to provide the sealed space192 c.

In such an approach, an acoustic impedance difference can be large at aninterface between the first plate 192 a and the sealed member 192 d andat an interface between the second plate 192 b and the sealed member 192d. Thus, the ultrasonic wave from the transmitting device 111 is easilyreflected at each interface so that the propagation of the ultrasonicwave from the transmitting device 111 to the receiving devices 112 p-112r can be reduced. For example, the sealed member 192 d can be gel or gassuch as air. Gas has high compressibility, and gel has large dampingconstant. Therefore, the sealed member 192 d can suitably absorb thepropagation of the ultrasonic wave from the transmitting device 111 tothe receiving devices 112 p-112 r.

The vibration isolator 192 can further include a honeycomb member (notshown) placed in the sealed space 192 c to partition the sealed space192 c. In such an approach, the propagation of the ultrasonic wave fromthe transmitting device 111 to the receiving devices 112 p-112 r can beefficiently reduced. Further, strength of the vibration isolator 192 canbe increased.

Alternatively, as shown in FIG. 24, the ultrasonic sensor 140 can have avibration isolator 193 instead of the vibration isolator 191. Thevibration isolator 193 has a trapped gas bubble 193 a. An acousticimpedance difference in the vibration isolator 193 can be large at thetrapped gas bubble 193 a. Therefore, the ultrasonic wave from thetransmitting device 111 is easily reflected at the trapped gas bubble193 a so that the propagation of the ultrasonic wave from thetransmitting device 111 to the receiving devices 112 p-112 r can bereduced. The vibration isolator 193 can be easily manufactured comparedto the other vibration isolators. Therefore, manufacturing cost of theultrasonic sensor 140 can be reduced.

As described above, according to the seventh embodiment, the ultrasonicsensor 140 can have the following advantages.

(1) The vibration isolator 191 includes the first plate 191 a, thesecond plate 191 b, and the core layer 191 c sandwiched between thefirst and second plates 191 a, 191 b. Each of the first and secondplates 191 a, 191 b has the higher acoustic impedance than the corelayer 191 c. Therefore, the acoustic impedance difference in thevibration isolator 191 is large at the interface between the first plate191 a and the core layer 191 c and at the interface between the secondplate 191 b and the core layer 191 c. Thus, the ultrasonic wave from thetransmitting device 111 is easily reflected at each interface so thatthe propagation of the ultrasonic wave from the transmitting device 111to the receiving devices 112 p-112 r can be reduced.

(2) The ultrasonic sensor 140 can have the vibration isolator 192instead of the vibration isolator 191. The vibration isolator 192includes the first plate 192 a, the second plate 192 b, and the sealedspace 192 c filled with the sealed member 192 d. Each of the first andsecond plates 192 a, 192 b has the higher acoustic impedance than thesealed member 192 d. The acoustic impedance difference in the vibrationisolator 192 can be large at the interface between the first plate 192 aand the sealed member 192 d and at the interface between the secondplate 192 b and the sealed member 192 d. Thus, the ultrasonic wave fromthe transmitting device 111 is easily reflected at each interface sothat the propagation of the ultrasonic wave from the transmitting device111 to the receiving devices 112 p-112 r can be reduced. The sealedmember 192 d can be gel or gas such as air. Gas has highcompressibility, and gel has large damping constant. Therefore, thesealed member 192 d can suitably absorb the propagation of theultrasonic wave.

(3) The vibration isolator 192 can further include the honeycomb layer(not shown) placed in the sealed space 192 c to partition the sealedspace 192 c. In such an approach, the propagation of the ultrasonic wavefrom the transmitting device 111 to the receiving devices 112 p-112 canbe efficiently reduced, and the strength of the vibration isolator 192can be increased.

(4) The ultrasonic sensor 140 can have the vibration isolator 193instead of the vibration isolator 191. The vibration isolator 193 hasthe trapped gas bubble 193 a. The acoustic impedance difference in thevibration isolator 193 can be large at the trapped gas bubble 193 a.Therefore, the ultrasonic wave from the transmitting device 111 iseasily reflected at the trapped gas bubble 193 a so that the propagationof the ultrasonic wave from the transmitting device 111 to the receivingdevices 112 p-112 r can be reduced. The vibration isolator 193 can beeasily manufactured so that the manufacturing cost of the ultrasonicsensor 140 can be reduced.

Eighth Embodiment

An ultrasonic sensor 150 according to an eighth embodiment of thepresent invention is described below with reference to FIG. 25.Differences between the fourth and eighth embodiments are as follows.

As shown in FIG. 25, the ultrasonic sensor 150 includes a housing 131 binstead of the housing 131 and a vibration isolator 194 instead of thevibration isolator 190. The housing 131 b has a through hole 131 c on abottom 131 a. The vibration isolator 194 has an extension 194 a exposedoutside the housing 131 b through the through hole 131 c. An elasticmember 151 is attached to the extension 194 a to reduce a vibration ofthe extension 194 a. For example, the elastic member 151 can be made ofrubber, gel, or the like.

In such an approach, a resonance frequency of the vibration isolator 194can be reduced. Further, since the vibration of the extension 194 a isreduced by the elastic member 151, the vibration of the entire vibrationisolator 194 is reduced accordingly. Thus, the propagation of theultrasonic wave from the transmitting device 111 to the receivingdevices 112 p-112 r can be reduced.

As described above, according to the eighth embodiment, the ultrasonicsensor 150 can have the following advantages.

(1) The vibration isolator 194 has the extension 194 a exposed outsidethe housing 131 b through the through hole 131 c. Thus, the resonancefrequency of the vibration isolator 194 can be reduced. Further, sincethe extension 194 a is exposed outside the housing 131 b, the vibrationof the vibration isolator 194 can be effectively reduced at theextension 194 a. Thus, the propagation of the ultrasonic wave from thetransmitting device 111 to the receiving devices 112 p-112 r can bereduced.

(2) The elastic member 151 is attached to the extension 194 a of thevibration isolator 194. Thus, the vibration of the extension 194 a isreduced by the elastic member 151. The vibration of the entire vibrationisolator 194 is reduced accordingly.

Ninth Embodiment

An ultrasonic sensor 160 according to a ninth embodiment of the presentinvention is described below with reference to FIG. 26. Differencesbetween the fourth and ninth embodiments are as follows.

As shown in FIG. 26, the ultrasonic sensor 160 includes an actuator 161serving as a noise chancellor. The actuator 161 is placed between thevibration isolator 190 and the bottom 131 a of the housing 131. Theactuator 161 is electrically coupled to the circuit device (not shown)through a wire 161 a. The actuator 161 detects the vibration of thevibration isolator 190 and applies a vibration having opposite phase tothe detected vibration to the vibration isolator 190, thereby dampingthe vibration of the vibration isolator 190. Alternatively, thevibration applied by the actuator 161 to the vibration isolator 190 canbe adjusted according to pressure of the ultrasonic wave emitted by thetransmitting device 111.

The actuator 161 can be placed between the bottom 131 a and each of thereceiving devices 112 p-112 r. In this case, the actuator 161 detectsvibrations of the receiving devices 112 p-112 r and applies vibrationshaving opposite phase to the detected vibrations to the receivingdevices 112 p-112 r, thereby damping the vibrations of the receivingdevices 112 p-112 r.

As described above, according to the ninth embodiment, the ultrasonicsensor 160 includes the actuator 161 placed between the vibrationisolator 190 and the bottom 131 a of the housing 131. The actuator 161detects the vibration of the vibration isolator 190 and applies thevibration having opposite phase to the detected vibration to thevibration isolator 190, thereby damping the vibration of the vibrationisolator 190. Thus, the propagation of the ultrasonic wave from thetransmitting device 111 to the receiving devices 112 p-112 r can bereduced.

Tenth Embodiment

An ultrasonic sensor 170 according to a tenth embodiment of the presentinvention is described below with reference to FIGS. 27A and 27B.Differences between the fourth and tenth embodiments are as follows. Theultrasonic sensor 170 has transmitting device 11 and one receivingdevice 112 p. Alternatively, like the fourth embodiment, the ultrasonicsensor 170 can have three receiving devices 112 p-112 r.

As shown in FIGS. 27A and 27B, the ultrasonic sensor 170 has a vibrationisolator 195 instead of the vibration isolator 190. The vibrationisolator 195 has uneven side surfaces with recesses and projections.

A resonant frequency of the vibration isolator 195 depends on the shapeof the uneven side surfaces. Therefore, resonance of the vibrationisolator 195 can be reduced by adjusting the shape of the uneven sidesurfaces.

As described above, according to the ultrasonic sensor 170 of the tenthembodiment, the vibration isolator 195 has the uneven side surfaces.Since the resonant frequency of the vibration isolator 195 depends onthe shape of the uneven side surfaces, the resonance of the vibrationisolator 195 can be reduced by adjusting the shape of the uneven sidesurfaces.

Eleventh Embodiment

An ultrasonic sensor 180 according to an eleventh embodiment of thepresent invention is described below with reference to FIGS. 28A and28B. Differences between the fourth and eleventh embodiments are asfollows. The ultrasonic sensor 180 has one transmitting device 111 andone receiving device 112 p. Alternatively, like the fourth embodiment,the ultrasonic sensor 180 can have three receiving devices 112 p-112 r.

As shown in FIGS. 28A and 28B, the ultrasonic sensor 180 has a vibrationisolator 196 instead of the vibration isolator 190. The vibrationisolator 196 has an edge portion 196 a supported by the housing 131. Thethickness of the edge portion 196 a is smaller than that of a centerportion 196 b of the vibration isolator 196. That is, the vibrationisolator 196 is supported by the housing 131 at its edge and thinner atits edge than at its center.

When the ultrasonic wave from the transmitting device 111 propagates tothe vibration isolator 196, the center portion 196 b is less likely tovibrate than the edge portion 196 a. Therefore, the propagation of theultrasonic wave to the receiving device 112 p can be reduced.

As described above, according to the ultrasonic sensor 180 of theeleventh embodiment, the vibration isolator 196 is thinner at the edgeportion 196 a supported by the housing 131 than at the center portion196 b. When the ultrasonic wave from the transmitting device 111propagates to the vibration isolator 196, the center portion 196 b isless likely to vibrate than the edge portion 196 a. Therefore, thepropagation of the ultrasonic wave from the transmitting device 111 tothe receiving device 112 p can be reduced.

Twelfth Embodiment

An ultrasonic sensor 180 a according to a twelfth embodiment of thepresent invention is described below with reference to FIGS. 29A and29B. Differences between the fourth and twelfth embodiments are asfollows. The ultrasonic sensor 180 a has one transmitting device 111 andone receiving device 112 p. Alternatively, like the fourth embodiment,the ultrasonic sensor 180 a can have three receiving devices 112 p-112r.

As shown in FIGS. 29A and 29B, the vibration isolator 190 of theultrasonic sensor 180 a has reinforcements 197 on a first side surfacefacing the receiving device 112 p. For example, the reinforcements 197are equally spaced from each other. The vibration isolator 190 isreinforced by the reinforcements 197 so that the vibration isolator 190can have high strength. Alternatively, the vibration isolator 190 canhave the reinforcements 197 on a second side facing the transmittingdevice 111.

The reinforcements 197 can be arranged in a honeycomb structure. In suchan approach, the strength of the vibration isolator 190 can be muchincreased by the reinforcements 197.

As described above, according to the ultrasonic sensor 180 a of thetwelfth embodiment, the vibration isolator 190 is reinforced by thereinforcements 197 so that the strength of the vibration isolator 190can be increased.

The strength of the vibration isolator 190 can be much increased byarranging the reinforcements 197 in a honeycomb structure.

Thirteenth Embodiment

An ultrasonic sensor 180 b according to a thirteenth embodiment of thepresent invention is described below with reference to FIGS. 30A and30B. Differences between the fourth and thirteenth embodiments are asfollows.

As shown in FIGS. 30A and 30B, the vibration damper 118 of theultrasonic sensor 180 b has a slit 118 b that is formed on each side ofthe vibration isolator 190 along the vibration isolator 190. One slit118 b is located between the vibration isolator 190 and the acousticmatching member 113 of the transmitting device 111. The other slit 118 bis located between the vibration isolator 190 and the acoustic matchingmembers 113 p-113 r of the receiving devices 112 p-112 r.

The vibration from the acoustic matching member 113 of the transmittingdevice 111 is distributed at the slit 118 b. Thus, the slit 118 breduces the propagation of the ultrasonic wave from the transmittingdevice 111 to the receiving devices 112 p-112 r. In FIGS. 30A and 30B,the slit 118 b is formed on each side of the vibration isolator 190.Alternatively, the slit 118 b can be formed on only one side of thevibration isolator 190. Multiple slits 118 b can be formed on each sideor one side of the vibration isolator 190. In FIGS. 30A and 30B, theslit 118 b is formed continuously along the vibration isolator 190.Alternatively, the slit 118 b can be formed intermittently along thevibration isolator 190.

As described above, according to the ultrasonic sensor 180 b of thethirteenth embodiment, the vibration damper 118 has the slit 118 b. Theslit 118 b is located between the acoustic matching member 113 of thetransmitting device 111 and each of the acoustic matching members of thereceiving devices 112 p-112 r. Thus, the propagation of the ultrasonicwave from the transmitting device 111 is distributed at the slit 118 bso that the propagation of the ultrasonic wave to the receiving devices112 p-112 r can be reduced.

Fourteenth Embodiment

An ultrasonic sensor 180 c according to a fourteenth embodiment of thepresent invention is described below with reference to FIG. 31.Differences between the fourth and fourteen embodiments are as follows.

As shown in FIG. 31, the ultrasonic sensor 180 c includes onetransmitting device 111 and two receiving devices 112 p, 112 q. Thereceiving devices 112 p, 112 q are arranged such that a distance fromthe receiving device 112 p to the vibration isolator 190 is equal to adistance from the receiving device 112 q to the vibration isolator 190.Further, the receiving devices 112 p, 112 q are arranged such that adistance from the receiving device 112 p to the transmitting device 111is equal to a distance from the receiving device 112 q to thetransmitting device 111.

In such an approach, the propagation of the ultrasonic wave from thetransmitting device 111 to the receiving devices 112 p, 112 q occurs atthe same time. Therefore, influence of the propagation on the receivingdevices 112 p, 112 q can be easily reduced by signal processing.

The ultrasonic sensor 180 c can include three or more receiving devices.For example, as shown in FIG. 32, the ultrasonic sensor 180 c caninclude four receiving devices 112 p-112 s that are arranged such that adistance from each of the receiving devices 112 p-112 s to the vibrationisolator 190 is the same, and such that a distance from each of thereceiving devices 112 p-112 s to the transmitting device 111 is thesame.

Further, as shown in FIG. 33, the ultrasonic sensor 180 c can have avibration isolator 198 instead of the vibration isolator 190. Thevibration isolator 198 has a honeycomb structure to partition the innerspace of the housing 131 into multiple spaces 198 a-198 g. The space 198a is located adjacent to each of the other spaces 198 b-198 g so thatthe space 198 a can be located in the center of the spaces 198 a-198 g.The transmitting device 111 is arranged in the center space 198 a.Receivers 112 are respectively arranged in the other spaces 198 b-198 gsuch that a distance from each receiving device 112 to the transmittingdevice 111 is the same. Since the vibration isolator 198 has a honeycombstructure, the vibration isolator 198 has high strength.

As described above, according to the ultrasonic sensor 180 c of thefourteenth embodiment, the following advantages can be achieved.

(1) The receiving devices are arranged such that the distance from eachreceiving device to the vibration isolator 190 is the same, and suchthat the distance from each receiving device to the transmitting device111 is the same. In such an approach, the propagation of the ultrasonicwave from the transmitting device 111 to the receiving devices occurs atthe same time. Therefore, influence of the propagation on the receivingdevices can be easily reduced by signal processing.

The ultrasonic sensor 180 c can have the vibration isolator 198 insteadof the vibration isolator 190. The vibration isolator 198 has ahoneycomb structure to partition the inner space of the housing 131 intomultiple spaces 198 a-198 g. The transmitting device 111 is arranged inthe center space 198 a, and the receiving devices are respectivelyarranged in the other spaces 198 b-198 g in such a manner that adistance from each receiving device to the transmitting device 111 isthe same. Since the vibration isolator 198 has a honeycomb structure,the vibration isolator 198 has high strength.

Modifications of Embodiments

The embodiments described above can be modified in various ways. Forexample, the ultrasonic sensors 10-30, 110-180 c can be mounted to aportion other than the bumper 51 of the vehicle. The ultrasonic sensors10-30, 110-180 c can be used as an obstacle sensor mounted to a robot.

Such changes and modifications are to be understood as being within thescope of the present invention as defined by the appended claims.

1. An ultrasonic sensor for detecting an object, comprising: atransmitting device for transmitting ultrasonic wave to the object; aplurality of receiving devices, each of which receives the ultrasonicwave reflected from the object and outputs a received signalcorresponding to the received ultrasonic wave, the plurality ofreceiving devices including a reference receiving device and at leastone non-reference receiving device; and a circuit device electricallycoupled to the plurality of receiving devices and processing thereceived signals outputted from the plurality of receiving devices, thecircuit device including a reference signal generator, a firstsynchronous detector, and a second synchronous detector, wherein thereference signal generator generates a reference signal by using thereceived signal of the reference receiving device, the first synchronousdetector performs synchronous detection of the received signal of one ofthe reference receiving device and the non-reference receiving devicebased on the reference signal to detect a time interval betweentransmitting and receiving the ultrasonic wave, the first synchronousdetector calculating a distance to the object based on the detected timeinterval, and the second synchronous detector performs synchronousdetection of the received signal of the non-reference receiving devicebased on the reference signal to detect a phase difference between thereceived signals of the reference receiving device and the non-referencereceiving device, the second synchronous detector calculating adirection of the object based on the phase difference.
 2. The ultrasonicsensor according to claim 1, wherein the reference signal generatorincludes a phase-looked loop.
 3. The ultrasonic sensor according toclaim 1, wherein the transmitting device transmits the ultrasonic waveupon reception of a transmission signal outputted from the circuitdevice, and the first synchronous detector detects the time intervalbased on the transmission signal.
 4. The ultrasonic sensor according toclaim 1, wherein the non-reference receiving device comprises at leasttwo non-reference receiving devices that are arranged in an array withthe reference receiving device, a first one of the non-referencereceiving devices is located in a first direction with respect to thereference receiving device, and a second one of the non-referencereceiving devices is located in a second direction with respect to thereference receiving device, the second direction being perpendicular tothe first direction.
 5. The ultrasonic sensor according to claim 1,wherein the non-reference receiving device comprises at least twonon-reference receiving devices that are arranged in an array with thereference receiving device, and the non-reference receiving devices arearranged circularly around the reference receiving device.
 6. Theultrasonic sensor according to claim 1, wherein the transmitting device,the reference receiving device, and the non-reference receiving deviceare arranged in an array.
 7. The ultrasonic sensor according to claim 1,wherein the circuit device further includes a majority circuit, thenon-reference receiving device comprises at least three non-referencereceiving devices arranged in a line, and the received signals of thenon-reference receiving devices are inputted to the majority circuit. 8.The ultrasonic sensor according to claim 1, wherein the transmittingdevice comprises a plurality of transmitting devices.
 9. The ultrasonicsensor according to claim 1, wherein the ultrasonic sensor is mountableon a vehicle with a speed sensor that detects a vehicle speed, and thecircuit device further includes a speed correction circuit that correctsthe reference signal based on the detected vehicle speed.
 10. Theultrasonic sensor according to claim 1, wherein the ultrasonic sensor ismountable on a vehicle with a temperature sensor that detects atemperature outside the vehicle, and the circuit device further includesa temperature correction circuit that corrects the reference signalbased on the detected temperature.
 11. The ultrasonic sensor accordingto claim 1, wherein the transmitting device transmits the ultrasonicwave upon reception of a transmission signal outputted from the circuitdevice, the circuit device includes a drive signal generator thatoutputs a drive signal to the plurality of receiving devices based onthe transmission signal, and the drive signal causes the plurality ofreceiving devices to produce a first vibration that cancels a secondvibration propagating from the transmitting device to the plurality ofreceiving devices.
 12. An ultrasonic sensor for detecting an object,comprising: a plurality of sensing devices arranged in an array, each ofwhich includes a piezoelectric element and an acoustic matching memberhaving a first surface exposed to space where the object exists and asecond surface joined to the piezoelectric element; and a circuit deviceelectrically coupled to the piezoelectric element, wherein one of theplurality of sensing devices is configured as a transmitting device thattransmits ultrasonic wave upon reception of a transmission signaloutputted from the circuit device, and at least another one theplurality of sensing devices is configured as a receiving device thatreceives the ultrasonic wave reflected from the object and outputs areceived signal corresponding to the received ultrasonic wave to thecircuit device, the circuit device includes a drive signal generatorthat outputs a drive signal to the receiving device based on thetransmission signal, and the drive signal causes the piezoelectricelement of the receiving device to vibrate such that a vibration signalpropagated from the transmitting device to the receiving device iscancelled.
 13. The ultrasonic sensor according to claim 12, wherein aphase difference between the drive signal and the vibration signalranges from 110 degrees to 250 degrees.
 14. The ultrasonic sensoraccording to claim 12, wherein the drive signal comprises a plurality ofcontinuous waves, the vibration signal comprises a plurality ofcontinuous waves, and at most initial two of the plurality of continuouswaves of the drive signal are inputted to the receiving device before aninitial one of the plurality of continuous waves of the vibration signalpropagates to the receiving device.
 15. The ultrasonic sensor accordingto claim 12, wherein the drive signal comprises a plurality ofcontinuous waves, the vibration signal comprises a plurality ofcontinuous waves, and at most last two of the plurality of continuouswaves of the drive signal are inputted to the receiving device after alast one of the plurality of continuous waves of the vibration signalpropagates to the receiving device.
 16. The ultrasonic sensor accordingto claim 12, wherein the drive signal comprises a plurality ofcontinuous waves, the vibration signal comprises a plurality ofcontinuous waves, and a last one of the plurality of continuous waves ofthe drive signal is inputted to the receiving device when a second lastone of the plurality of continuous waves of the vibration signalpropagates to the receiving device.
 17. The ultrasonic sensor accordingto claim 12, wherein a ratio of a magnitude of the drive signal to amagnitude of the vibration signal ranges from 50 percent to 100 percent.18. The ultrasonic sensor according to claim 12, wherein the drivesignal causes the piezoelectric element of the receiving device tovibrate such that a reverberation vibration of the acoustic matchingmember propagating to the piezoelectric element of the receiving deviceis cancelled, and the propagation of the reverberation vibration to thepiezoelectric element of the receiving device follows a propagation ofthe received ultrasonic wave to the piezoelectric element of thereceiving device.
 19. An ultrasonic sensor for detecting an object,comprising: a plurality of sensing devices arranged in an array, each ofwhich includes a piezoelectric element and an acoustic matching memberhaving a first surface exposed to space where the object exists and asecond surface joined to the piezoelectric element; and a circuit deviceelectrically coupled to the piezoelectric element, wherein a first oneof the plurality of sensing devices is configured as a transmittingdevice that transmits ultrasonic wave upon reception of a transmissionsignal outputted from the circuit device, and a second one of theplurality of sensing devices is configured as a dummy device thatdetects only a vibration signal corresponding to a vibration propagatingfrom the transmitting device to the dummy device, at least another oneof the plurality of sensing devices is configured as a receiving devicethat receives the ultrasonic wave reflected from the object and outputsa received signal corresponding to the received ultrasonic wave to thecircuit device, and the circuit device subtracts the vibration signalfrom the received signal of the receiving device to cancel a vibrationpropagated from the transmitting device to the receiving device.
 20. Anultrasonic sensor for detecting a first object, comprising: atransmitting device for transmitting ultrasonic wave to the firstobject, the transmitting device including a first piezoelectric elementfor emitting the ultrasonic wave and a first acoustic matching memberhaving a transmitting surface, the emitted ultrasonic wave propagatedthrough the first acoustic matching member and being transmitted throughthe transmitting surface to the first object, the first piezoelectricelement being configured as a multilayer piezoelectric element includinga plurality of piezoelectric layers and a plurality of electrode layersinterleaved with the plurality of piezoelectric layers; a receivingdevice, arranged in an array with the transmitting device, for receivingthe ultrasonic wave reflected from the first object, the receivingdevice including a second piezoelectric element for detecting thereflected ultrasonic wave and a second acoustic matching member having areceiving surface, the reflected ultrasonic wave being received throughthe receiving surface and propagated through the second acousticmatching member to the second piezoelectric element; a housing having aninner space for accommodating the transmitting device and the receivingdevice, the housing having a bottom and an opening portion, the housingbeing mountable to a second object at the opening portion; a vibrationdamper interposed between the opening portion of the housing and each ofthe first and second acoustic matching members to fix the first andsecond acoustic matching members to the housing, the vibration damperbeing interposed between the first and second acoustic matching membersto reduce a propagation of the ultrasonic wave between the first andsecond acoustic matching members; and a vibration isolator forpartitioning the inner space of the housing and located between thetransmitting device and the receiving device to reduce the propagationof the ultrasonic wave between the transmitting device and the receivingdevice.
 21. The ultrasonic sensor according to claim 20, furthercomprising: a first absorber interposed between the bottom of thehousing and each of the first and second piezoelectric elements andbetween an inner side wall of the housing and each of the first andsecond piezoelectric elements to protect the transmitting device and thereceiving device from external force, wherein the vibration isolator hasa higher acoustic matching impedance than the first absorber.
 22. Theultrasonic sensor according to claim 20, wherein the vibration isolatoris integrally formed with the housing.
 23. The ultrasonic sensoraccording to claim 20, wherein the vibration isolator has a firstthickness on the first and second acoustic matching members side and asecond thickness on the first and second piezoelectric elements side,and the first thickness is less than the second thickness.
 24. Theultrasonic sensor according to claim 20, wherein the vibration isolatorincludes first and second members and a core member that are layeredtogether such that the core member is sandwiched between the first andsecond members, and each of the first and second members has a higherelastic modulus than the core member.
 25. The ultrasonic sensoraccording to claim 20, wherein the vibration isolator includes first andsecond members and a core member that are layered together such that thecore member is sandwiched between the first and second members, and eachof the first and second members has a higher acoustic impedance than thecore member.
 26. The ultrasonic sensor according to claim 20, whereinthe vibration isolator includes first and second members that are joinedtogether to provide a sealed space therebetween, and the sealed space isfilled with a material having a lower acoustic impedance than those ofeach of the first and second members.
 27. The ultrasonic sensoraccording to claim 26, wherein the vibration isolator includes ahoneycomb structural body placed in the sealed space to partition thesealed space into a plurality of spaces.
 28. The ultrasonic sensoraccording to claim 20, wherein the vibration isolator has a plurality ofgas bubbles trapped therein.
 29. The ultrasonic sensor according toclaim 20, further comprising: a second absorber located on the firstabsorber to surround the first and second piezoelectric elements,wherein the second absorber has a lower elastic modulus than the firstabsorber.
 30. The ultrasonic sensor according to claim 29, wherein thefirst absorber includes a first portion located on the firstpiezoelectric element side and a second portion located on the secondpiezoelectric element side, and the first portion of the first absorberhas a higher elastic modulus than the second portion of the firstabsorber.
 31. The ultrasonic sensor according to claim 30, wherein thefirst portion of the first absorber has a greater height, measured fromthe bottom of the housing, than the second portion of the firstabsorber.
 32. The ultrasonic sensor according to claim 20, wherein thetransmitting surface of the transmitting device and the receivingsurface of the receiving device are covered with the vibration damper.33. The ultrasonic sensor according to claim 20, wherein thetransmitting device or the receiving device comprises a plurality ofdevices having different directivities.
 34. The ultrasonic sensoraccording to claim 20, wherein the bottom of the housing has a throughhole, and the vibration isolator has a portion exposed outside thehousing through the through hole.
 35. The ultrasonic sensor according toclaim 34, wherein the vibration isolator has a vibration inhibitorattached to the exposed potion of the vibration isolator to inhibit theexposed portion from vibrating.
 36. The ultrasonic sensor according toclaim 20, further comprising: a vibration damping circuit configured toapply to the vibration isolator a vibration having an opposite phase toa vibration of the vibration isolator to damp the vibration of thevibration isolator.
 37. The ultrasonic sensor according to claim 20,wherein the vibration isolator has an uneven side surface.
 38. Theultrasonic sensor according to claim 20, wherein the vibration isolatoris supported by the housing at an edge portion, and the vibrationisolator is thinner at the edge portion than at a center portion. 39.The ultrasonic sensor according to claim 20, wherein the vibrationisolator is reinforced with a reinforcing member placed on a sidesurface.
 40. The ultrasonic sensor according to claim 39, wherein thereinforcing member has a honeycomb structure.
 41. The ultrasonic sensoraccording to claim 20, wherein the vibration damper has a slit locatedbetween the first and second acoustic matching members.
 42. Theultrasonic sensor according to claim 20, wherein the receiving devicecomprises a plurality of receiving devices, and a distance from eachreceiving device to the transmitting device is the same, and a distancefrom each receiving device to the vibration isolator is the same. 43.The ultrasonic sensor according to claim 20, wherein the receivingdevice comprises a plurality of receiving devices, and the vibrationisolator has a honeycomb structure to partition the inner space of thehousing into a plurality of spaces, the transmitting device is placed ina central one of the plurality of spaces, each receiving device isplaced in a corresponding space other than the central one, and adistance from each receiving device to the transmitting device is thesame.